Gallium-effect in a lead-free solder for silver-sheathed superconducting tape

Shin Ichi Shamoto, Min Kai Lee, Yuki Fujimura, Keietsu Kondo, Takashi U. Ito, Kazuhiko Ikeuchi, Satoshi Yasuda, Lieh Jeng Chang

Research output: Contribution to journalArticlepeer-review

Abstract

Solder joints of silver-sheathed superconducting tapes are promising for various commercial applications. In this research, Pb, Ga, and Ga-doped lead-free Sn-Ag-Cu solders are used to study the gallium effect for the low joint resistivity with silver-sheathed DI-BISCCO type H tapes. In Ga-doped Sn-Ag-Cu solder, a smooth interfacial Ag2Ga layer is uniformly formed on the Ag-sheath surface. As a result, the solder joint achieved a very low joint resistivity of 16 nΩcm2 at 40 K. The present gallium-doped lead-free solder can also be applied to general soldering use with Ag materials.

Original languageEnglish
Article number076303
JournalMaterials Research Express
Volume8
Issue number7
DOIs
Publication statusPublished - 2021 Jul

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Biomaterials
  • Surfaces, Coatings and Films
  • Polymers and Plastics
  • Metals and Alloys

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