Abstract
Nitride-based light-emitting diodes (LEDs) with textured sidewall, GaN μ-pillars around mesa region, patterned sapphire substrate (PSS), and highly reflective Ag-Cr-Au electrode pads were fabricated using the conventional lithography method (labeled as experimental LEDs). When a 20-mA injection current was applied, forward voltages were 3.18 and 3.4 V for the conventional and experimental LEDs, respectively. The high 20-mA Vf of LEDs with Ag-Cr-Au electrode pads could be attributed to the fact that the specific contact resistance of n+-GaN-Ag-Cr-Au is slightly higher than that of the n+-GaN-Cr-Au contact. It was found that we could achieve much stronger LED output power with textured sidewalls, GaN μ-pillars around mesa region, PSS, and highly reflective Ag-Cr-Au electrode pads. It was also found that we could enhance LED output power by more than 80% compared with the conventional LEDs.
| Original language | English |
|---|---|
| Pages (from-to) | 1659-1661 |
| Number of pages | 3 |
| Journal | IEEE Photonics Technology Letters |
| Volume | 21 |
| Issue number | 22 |
| DOIs | |
| Publication status | Published - 2009 Nov 15 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Atomic and Molecular Physics, and Optics
- Electrical and Electronic Engineering
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