TY - GEN
T1 - Green Microfluidic Electrogenerated Chemiluminescence Device Using 9,10-Diphenylanthracene as a Host Material
AU - Kato, Emiri
AU - Ishimatsu, Ryoichi
AU - Mizuno, Jun
AU - Kasahara, Takashi
N1 - Publisher Copyright:
© 2022 Japan Institute of Electronics Packaging.
PY - 2022
Y1 - 2022
N2 - We propose a green microfluidic electrogenerated chemiluminescence (ECL) device using 9,10-diphenylanthracene (DPA), which is one of the most studied deep-blue ECL material, as a host material. The ECL solution was prepared by dissolving DPA in an organic solvent along with green guest and assist dopant materials. 5,12-Dibutyl-1,3,8,10-tetramethylquinacridone (TMDBQA) was used as the gust, while 4,4'-bis[4-(diphenylamino)- styryl]biphenyl (BDAVBi) was used as the assist dopant. The microfluidic device with the prepared solution exhibited bright green emission. The obtained ECL spectrum was found to be almost identical to the photoluminescence spectrum of TMDBQA, and no significant contributions from DPA and BDAVBi were observed in the spectrum. We expect that the DPA host solution is promising for the fabrication of highly luminescent ECL devices.
AB - We propose a green microfluidic electrogenerated chemiluminescence (ECL) device using 9,10-diphenylanthracene (DPA), which is one of the most studied deep-blue ECL material, as a host material. The ECL solution was prepared by dissolving DPA in an organic solvent along with green guest and assist dopant materials. 5,12-Dibutyl-1,3,8,10-tetramethylquinacridone (TMDBQA) was used as the gust, while 4,4'-bis[4-(diphenylamino)- styryl]biphenyl (BDAVBi) was used as the assist dopant. The microfluidic device with the prepared solution exhibited bright green emission. The obtained ECL spectrum was found to be almost identical to the photoluminescence spectrum of TMDBQA, and no significant contributions from DPA and BDAVBi were observed in the spectrum. We expect that the DPA host solution is promising for the fabrication of highly luminescent ECL devices.
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U2 - 10.23919/ICEP55381.2022.9795648
DO - 10.23919/ICEP55381.2022.9795648
M3 - Conference contribution
AN - SCOPUS:85133309782
T3 - 2022 International Conference on Electronics Packaging, ICEP 2022
SP - 25
EP - 26
BT - 2022 International Conference on Electronics Packaging, ICEP 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 21st International Conference on Electronics Packaging, ICEP 2022
Y2 - 11 May 2022 through 14 May 2022
ER -