Growth of ultrathin barrier InAlGaN/GaN heterostructures with superior properties using sputtered AlN/sapphire templates and optimized group-III injection rate by metalorganic chemical vapor phase deposition

Xia Xi Zheng, Chun Wang, Jian Hao Huang, Jen Yao Huang, Daisuke Ueda, Krishna Pande, Chang Fu Dee, Ching Ting Lee, Edward Yi Chang

Research output: Contribution to journalArticlepeer-review

Abstract

In this paper, we investigate the influence of group-III precursor injection rate on the material and electrical properties of InAlGaN/GaN heterostructures grown by Metalorganic Chemical Vapor Phase Deposition. It is demonstrated that high-quality GaN layers can be achieved by using the sputtered AlN/sapphire templates. During the barrier layer growth, the injection rate of the Trimethylindium plays an important role in the amount of Ga incorporation into the InAlGaN layer, while the variation of Trimethylaluminum has less impact. High mobility of 1800 cm2/(V·s) and high carrier electron density with an ultrathin of 3 nm thickness InAlGaN barrier layer simultaneously maintaining high crystallinity and smooth surface of InAlGaN barrier layer is achieved with sputtered AlN/sapphire templates and optimized group-III injection rate.

Original languageEnglish
Article number139295
JournalThin Solid Films
Volume754
DOIs
Publication statusPublished - 2022 Jul 31

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

Fingerprint

Dive into the research topics of 'Growth of ultrathin barrier InAlGaN/GaN heterostructures with superior properties using sputtered AlN/sapphire templates and optimized group-III injection rate by metalorganic chemical vapor phase deposition'. Together they form a unique fingerprint.

Cite this