Heat exchanger fabrication with arrays of sensors and heaters with its micro-scale impingement cooling process analysis and measurements

C. H. Shen, C. Gau

Research output: Contribution to journalConference articlepeer-review

7 Citations (Scopus)

Abstract

The design and fabrication for the thermal chip of a heat exchanger with arrays of temperature sensors and heaters for study of micro-jet impingement cooling heat transfer process is presented. This thermal chip can minimize the heat loss from the system to the ambient and provide a uniform heat flux along the wall, thus, local heat transfer processes along the wall can be measured and obtained. The fabrication procedure presented can reach a chip yield of 100%. With fabrication of a micro-slot nozzle of B=200μm, therefore, micro-jet impingement cooling experiments can be performed to obtain the local micro-scale heat transfer Nusselt numbers along the wall. The experimental results indicate and the heat transfer process along the wall is significantly different from the case of large-scale jet impingement cooling process. Correlations for the micro-scale heat transfer cooling process have been successfully obtained.

Original languageEnglish
Pages (from-to)154-162
Number of pages9
JournalSensors and Actuators, A: Physical
Volume114
Issue number2-3
DOIs
Publication statusPublished - 2004 Sep 1
EventSelected Papers from Transducers 03 - Boston, MA, United States
Duration: 2003 Jun 82003 Jun 12

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Electrical and Electronic Engineering

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