Heat exchanger fabrication with arrays of sensors and heaters with its micro-scale impingement cooling process analysis and measurements

C. H. Shen, Chie Gau

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The design and fabrication for the thermal chip of a heat exchanger with arrays of temperature sensors and heaters for study of micro-jet impingement cooling heat transfer process is presented. This thermal chip can minimize the heat loss from the system to the ambient and provide a uniform heat flux along the wall, thus local heat transfer processes along the wall can be measured and obtained. The fabrication procedure presented can reach a chip yield of 100%, and every one of the sensors and heaters on the chip is in good operation condition. Therefore, micro-jet impingement cooling experiments can be performed to obtain both the local micro-scale heat transfer Nusselt number and flow structure along the wall. The experimental results indicate that both the micro-scale impinging jet flow structure and the heat transfer process along the wall is significantly different from the case of large-scale jet impingement cooling process.

Original languageEnglish
Title of host publicationTRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages639-642
Number of pages4
ISBN (Electronic)0780377311, 9780780377318
DOIs
Publication statusPublished - 2003 Jan 1
Event12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers - Boston, United States
Duration: 2003 Jun 82003 Jun 12

Publication series

NameTRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers
Volume1

Other

Other12th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2003 - Digest of Technical Papers
CountryUnited States
CityBoston
Period03-06-0803-06-12

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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    Shen, C. H., & Gau, C. (2003). Heat exchanger fabrication with arrays of sensors and heaters with its micro-scale impingement cooling process analysis and measurements. In TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers (pp. 639-642). [1215554] (TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers; Vol. 1). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SENSOR.2003.1215554