Heat exchanger fabrication with arrays of sensors and heaters with its micro-scale impingement cooling process analysis and measurements

The design and fabrication for the thermal chip of a heat exchanger with arrays of temperature sensors and heaters for study of micro-jet impingement cooling heat transfer process is presented. This thermal chip can minimize the heat loss from the system to the ambient and provide a uniform heat flux along the wall, thus, local heat transfer processes along the wall can be measured and obtained. The fabrication procedure presented can reach a chip yield of 100%. With fabrication of a micro-slot nozzle of B=200μm, therefore, micro-jet impingement cooling experiments can be performed to obtain the local micro-scale heat transfer Nusselt numbers along the wall. The experimental results indicate and the heat transfer process along the wall is significantly different from the case of large-scale jet impingement cooling process. Correlations for the micro-scale heat transfer cooling process have been successfully obtained.