Heat transfer analysis of aluminum honeycomb panels incorporating microencapsulted PCM

Chi-ming Lai, Shuichi Hokoi

Research output: Contribution to conferencePaperpeer-review

Abstract

This study combined engineering practice, microencapsulated phase change material (mPCM), and aluminum honeycomb structures to construct a mPCM honeycomb panel prototype. The thermal performance of this prototype and other modules (mPCM only, mPCM+EG, and mPCM+iron-wire) were investigated experimentally. The results indicated that the aluminum honeycomb used for structural support and heat conductivity enhancement in the prototype rapidly transferred the heat flux into the mPCM. Thus, the latent heat can be used to achieve a lower module surface temperature than other modules. A correlation of the effective thermal protection duration of the mPCM+honeycomb modules for Ste∗=2-5 and Sc∗=0.24-0.32 was proposed.

Original languageEnglish
Publication statusPublished - 2014 Jan 1
Event15th International Heat Transfer Conference, IHTC 2014 - Kyoto, Japan
Duration: 2014 Aug 102014 Aug 15

Other

Other15th International Heat Transfer Conference, IHTC 2014
CountryJapan
CityKyoto
Period14-08-1014-08-15

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering
  • Condensed Matter Physics

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