Heat transfer analysis of aluminum honeycomb panels incorporating microencapsulted PCM

Chi-ming Lai; Shuichi Hokoi

Heat transfer analysis of aluminum honeycomb panels incorporating microencapsulted PCM

Department of Civil Engineering

Research output: Contribution to conference › Paper › peer-review

Abstract

This study combined engineering practice, microencapsulated phase change material (mPCM), and aluminum honeycomb structures to construct a mPCM honeycomb panel prototype. The thermal performance of this prototype and other modules (mPCM only, mPCM+EG, and mPCM+iron-wire) were investigated experimentally. The results indicated that the aluminum honeycomb used for structural support and heat conductivity enhancement in the prototype rapidly transferred the heat flux into the mPCM. Thus, the latent heat can be used to achieve a lower module surface temperature than other modules. A correlation of the effective thermal protection duration of the mPCM+honeycomb modules for Ste∗=2-5 and Sc∗=0.24-0.32 was proposed.

Original language	English
Publication status	Published - 2014 Jan 1
Event	15th International Heat Transfer Conference, IHTC 2014 - Kyoto, Japan Duration: 2014 Aug 10 → 2014 Aug 15

Other

Other	15th International Heat Transfer Conference, IHTC 2014
Country/Territory	Japan
City	Kyoto
Period	14-08-10 → 14-08-15

All Science Journal Classification (ASJC) codes

Mechanical Engineering
Condensed Matter Physics

Cite this

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title = "Heat transfer analysis of aluminum honeycomb panels incorporating microencapsulted PCM",

abstract = "This study combined engineering practice, microencapsulated phase change material (mPCM), and aluminum honeycomb structures to construct a mPCM honeycomb panel prototype. The thermal performance of this prototype and other modules (mPCM only, mPCM+EG, and mPCM+iron-wire) were investigated experimentally. The results indicated that the aluminum honeycomb used for structural support and heat conductivity enhancement in the prototype rapidly transferred the heat flux into the mPCM. Thus, the latent heat can be used to achieve a lower module surface temperature than other modules. A correlation of the effective thermal protection duration of the mPCM+honeycomb modules for Ste∗=2-5 and Sc∗=0.24-0.32 was proposed.",

author = "Chi-ming Lai and Shuichi Hokoi",

year = "2014",

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day = "1",

language = "English",

note = "15th International Heat Transfer Conference, IHTC 2014 ; Conference date: 10-08-2014 Through 15-08-2014",

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TY - CONF

T1 - Heat transfer analysis of aluminum honeycomb panels incorporating microencapsulted PCM

AU - Lai, Chi-ming

AU - Hokoi, Shuichi

PY - 2014/1/1

Y1 - 2014/1/1

N2 - This study combined engineering practice, microencapsulated phase change material (mPCM), and aluminum honeycomb structures to construct a mPCM honeycomb panel prototype. The thermal performance of this prototype and other modules (mPCM only, mPCM+EG, and mPCM+iron-wire) were investigated experimentally. The results indicated that the aluminum honeycomb used for structural support and heat conductivity enhancement in the prototype rapidly transferred the heat flux into the mPCM. Thus, the latent heat can be used to achieve a lower module surface temperature than other modules. A correlation of the effective thermal protection duration of the mPCM+honeycomb modules for Ste∗=2-5 and Sc∗=0.24-0.32 was proposed.

AB - This study combined engineering practice, microencapsulated phase change material (mPCM), and aluminum honeycomb structures to construct a mPCM honeycomb panel prototype. The thermal performance of this prototype and other modules (mPCM only, mPCM+EG, and mPCM+iron-wire) were investigated experimentally. The results indicated that the aluminum honeycomb used for structural support and heat conductivity enhancement in the prototype rapidly transferred the heat flux into the mPCM. Thus, the latent heat can be used to achieve a lower module surface temperature than other modules. A correlation of the effective thermal protection duration of the mPCM+honeycomb modules for Ste∗=2-5 and Sc∗=0.24-0.32 was proposed.

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M3 - Paper

AN - SCOPUS:84964499586

T2 - 15th International Heat Transfer Conference, IHTC 2014

Y2 - 10 August 2014 through 15 August 2014

ER -

Heat transfer analysis of aluminum honeycomb panels incorporating microencapsulted PCM

Abstract

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All Science Journal Classification (ASJC) codes

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