Skip to main navigation Skip to search Skip to main content

Heat transfer and thermal storage behaviour of gypsum boards incorporating micro-encapsulated PCM

Research output: Contribution to journal › Article › peer-review

80   Link opens in a new tab Citations (Scopus)

Fingerprint

Dive into the research topics of 'Heat transfer and thermal storage behaviour of gypsum boards incorporating micro-encapsulated PCM'. Together they form a unique fingerprint.
Sort by

Engineering

Keyphrases