Heat transfer of impinging jet-array onto concave- and convex-dimpled surfaces with effusion

Shyy Woei Chang, Hsin Feng Liou

Research output: Contribution to journalArticle

23 Citations (Scopus)

Abstract

Heat transfer measurements for an impinging jet-array onto two enhanced surfaces using concave and convex dimples with effusion are performed to acquire the detailed Nusselt number (Nu) distributions. The study focuses on the effects of effusion on local and area-averaged heat transfer performances with jet Reynolds number (Re) and separation distance (S/Dj) varying in the ranges of 5000 ≤ Re ≤ 15,000 and 0.5 ≤ S/Dj ≤ 10. For each Re and S/Dj tested, three sets of heat transfer data are acquired from each effused impinging surface at three eccentricities (E) between jet-center and dimple-center of 0, 1/4 and 1/2 dimple-pitch (H). Effects of effusions on heat transfer performances are revealed by comparing the Nu measurements obtained from each dimpled surface with and without effusion. A set of selected experimental data illustrates the influences of effusion on the interdependent impacts of surface topology, Re, S/Dj and E/H on the detailed Nu distributions and the area-averaged Nu over the central jet region (over(Nu, -)C). Relative enhancement in heat transfer convected by each dimpled surface with and without effusion from the reference over(Nu, -)C obtained from the smooth-walled impinging surface without effusion is examined for each Re, S/Dj and E/H tested. To assist the engineering applications, six over(Nu, -)C correlations for two effused surfaces with concave and convex dimples at E/H = 0, 1/4 and 1/2 are individually obtained using Re and S/Dj as the controlling parameters.

Original languageEnglish
Pages (from-to)4484-4499
Number of pages16
JournalInternational Journal of Heat and Mass Transfer
Volume52
Issue number19-20
DOIs
Publication statusPublished - 2009 Sep 1

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Mechanical Engineering
  • Fluid Flow and Transfer Processes

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