Abstract
At a 1.2-nm equivalent oxide thickness, HfSix/Hf0.7 La0.3ON n-MOSFETs showed an effective work function of 4.33 eV, a low threshold voltage of 0.18 V, and a peak electron mobility of 215 cm2/(V · s). These self-aligned and gate-first HfSix/Hf0.7La0.3ON n-MOSFETs were processed using standard ion implantation and 1000-°C rapid thermal annealing,making them fully compatible with current very large scale integration fabrication lines.
Original language | English |
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Pages (from-to) | 1092-1094 |
Number of pages | 3 |
Journal | IEEE Electron Device Letters |
Volume | 28 |
Issue number | 12 |
DOIs | |
Publication status | Published - 2007 Dec |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering