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High-aspect-ratio Sub-2-μm vias using thermal imprint with build-up resin
Takumi Kamibayashi, Hiroyuki Kuwae, Takahiro Kishioka, Yuki Usui, Takuya Ohashi, Mamoru Tamura, Shuichi Shoji, Jun Mizuno
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
2
Citations
(Scopus)