High-breakdown voltage Al0.66In0.34As0.85Sb0.15/In 0.75Ga0.25As/InP heterostructure field-effect transistors

  • Jan Shing Su
  • , Wei Chou Hsu
  • , Dong Tsuen Lin
  • , Wei Lin
  • , Hung Pin Shiao
  • , Yu Shyan Lin
  • , Jean Zen Huang
  • , Piin Jye Chou

Research output: Contribution to journalArticlepeer-review

20 Citations (Scopus)

Abstract

Al0.66In0.34As0.85Sb 0.15/In0.75Ga0.25As/InP heterostructure field-effect transistors (HFETs) with high breakdown voltage have been successfully fabricated by low-pressure metal organic chemical vapour deposition (LP-MOCVD). By virtue of an Al0.66In0.34As0.85Sb0.15 Schottky layer and an inverted δ-doped carrier supplier, a gate-to-drain breakdown voltage as high as 40V can be obtained. Moreover, the temperature dependence of breakdown voltage shows a negative temperature coefficient.

Original languageEnglish
Pages (from-to)2095-2097
Number of pages3
JournalElectronics Letters
Volume32
Issue number22
DOIs
Publication statusPublished - 1996 Oct 24

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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