Abstract
A novel high breakdown voltage GaN HFET with a field plate (FP GaN HFET) to form a gamma-shape gate is presented. The use of the field plate significantly reduces the field strength under the gate near the drain side. Simulation results show that the peak electric field of the device is reduced from 1.2×106 V/cm to 0.9×106 V/cm for the particular structure used. A high breakdown voltage (over 110 V) is achieved and the average ratio of BVgd over BVgs reaches a value of 2.4, compared to that of only 1.038 for a conventional GaN HFET.
| Original language | English |
|---|---|
| Pages (from-to) | 196-197 |
| Number of pages | 2 |
| Journal | Electronics Letters |
| Volume | 37 |
| Issue number | 3 |
| DOIs | |
| Publication status | Published - 2001 Feb 1 |
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering