High breakdown voltage GaN HFET with field plate

  • J. Li
  • , S. J. Cai
  • , G. Z. Pan
  • , Y. L. Chen
  • , C. P. Wen
  • , K. L. Wang

Research output: Contribution to journalArticlepeer-review

41 Citations (Scopus)

Abstract

A novel high breakdown voltage GaN HFET with a field plate (FP GaN HFET) to form a gamma-shape gate is presented. The use of the field plate significantly reduces the field strength under the gate near the drain side. Simulation results show that the peak electric field of the device is reduced from 1.2×106 V/cm to 0.9×106 V/cm for the particular structure used. A high breakdown voltage (over 110 V) is achieved and the average ratio of BVgd over BVgs reaches a value of 2.4, compared to that of only 1.038 for a conventional GaN HFET.

Original languageEnglish
Pages (from-to)196-197
Number of pages2
JournalElectronics Letters
Volume37
Issue number3
DOIs
Publication statusPublished - 2001 Feb 1

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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