High density patterns fabricated in low-viscosity thermal-curable epoxy system for thermal-nanoimprint lithography

Chun Chang Wu, Steve Lien Chung Hsu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

EPON828 epoxy resin crosslinked by a curing agent 954 is compatible for thermocurable nanoimprint lithography and can be used in the PET/ITO plastic substrate. The relationships between curing temperature and conversion time of the EPON828/954 epoxy resin can be obtained from DSC Isothermal Kinetics Analysis. A curing agent 954 which can cure the epoxy resin at 90°C for 10 minutes. It is suitable for low-pressure and moderate-temperature imprint process. Advantages of epoxy resist includes no solvent' good fluidity' no byproduct' low shrinkage and Strong adhesion to a broad range of substrates.

Original languageEnglish
Title of host publicationDigest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC
Pages312-313
Number of pages2
DOIs
Publication statusPublished - 2007 Dec 1
Events20th International Microprocesses and Nanotechnology Conference, MNC 2007 - Kyoto, Japan
Duration: 2007 Nov 52007 Nov 8

Publication series

NameDigest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC

Other

Others20th International Microprocesses and Nanotechnology Conference, MNC 2007
CountryJapan
CityKyoto
Period07-11-0507-11-08

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All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Wu, C. C., & Hsu, S. L. C. (2007). High density patterns fabricated in low-viscosity thermal-curable epoxy system for thermal-nanoimprint lithography. In Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC (pp. 312-313). [4456229] (Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC). https://doi.org/10.1109/IMNC.2007.4456229