High-frequency surface acoustic wave (SAW) devices fabricated by Contact-Transferred and Mask-Embedded lithography

Chin Hsin Liu, Cheng Yu Chiu, Yung-Chun Lee, Shuo Hung Chang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper reports the application of a newly developed lithography method, the Contact Transfer and Mask-Embedded Lithography (CMEL), in fabricating high-frequency (∼2 GHz) surface acoustic wave (SAW) filters. In sort, CMEL utilizes a thin metal film deposited on an anti-adhesion layer and a silicon mold with pre-fabricated features. The metal film bearing the mold's surface pattern can be transferred into a photo-resist layer deposited on a substrate. Subsequent etchings complete the lithography and the micro/nano-fabrication. To demonstrate CMEL and its potential, we apply CMEL for fabricating interdigital transducers of SAW filters with a line width down to 500 nm. Using a LiNbO 3 substrate, the operating frequency can reach 1.8 to 2 GHz based on this simple and easy-to-implement lithography method. Details in the CMEL, the lithography results, the high-frequency performance of the fabricated SAW devices, as well as future developments of this simple lithography method will be addressed.

Original languageEnglish
Title of host publication3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008
Pages402-405
Number of pages4
DOIs
Publication statusPublished - 2008 Sep 1
Event3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 - Sanya, China
Duration: 2008 Jan 62008 Jan 9

Publication series

Name3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS

Other

Other3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008
CountryChina
CitySanya
Period08-01-0608-01-09

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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