@inproceedings{6b624dc72f634f37bb3c18c411ee9eed,
title = "High-performance inspecting system for detecting micro-crack defects of solar wafer",
abstract = "A novel inspecting system combining a tunable exposing unit for inspecting micro-cracks of solar wafers is proposed. With the infrared ray transmitting through silicon wafers, the inspecting images will be captured by a CCD camera, and the micro-crack defects from the images will be apparently appeared. So it can easier to precisely distinguish either micro-cracks or grainboundaries from the images by certain algorithms. This inspecting system is especially effective when the thickness of the multi-crystalline silicon wafer is not constant. Furthermore, this system is also useful for controlling quality in on-line process of solar cell production.",
author = "Ke, {Shun Sheng} and Lin, {Kun Wei} and Lin, {Yang Cheng} and Chen, {Jiun Ting} and Wang, {Yung Hsing} and Liu, {Chien Sheng}",
year = "2010",
doi = "10.1109/ICSENS.2010.5690149",
language = "English",
isbn = "9781424481682",
series = "Proceedings of IEEE Sensors",
pages = "494--497",
booktitle = "IEEE Sensors 2010 Conference, SENSORS 2010",
note = "9th IEEE Sensors Conference 2010, SENSORS 2010 ; Conference date: 01-11-2010 Through 04-11-2010",
}