High-performance inspecting system for detecting micro-crack defects of solar wafer

Shun Sheng Ke; Kun Wei Lin; Yang Cheng Lin; Jiun Ting Chen; Yung Hsing Wang; Chien Sheng Liu

doi:10.1109/ICSENS.2010.5690149

High-performance inspecting system for detecting micro-crack defects of solar wafer

Shun Sheng Ke, Kun Wei Lin, Yang Cheng Lin, Jiun Ting Chen, Yung Hsing Wang, Chien Sheng Liu

Department of Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

5 Citations (Scopus)

Abstract

A novel inspecting system combining a tunable exposing unit for inspecting micro-cracks of solar wafers is proposed. With the infrared ray transmitting through silicon wafers, the inspecting images will be captured by a CCD camera, and the micro-crack defects from the images will be apparently appeared. So it can easier to precisely distinguish either micro-cracks or grainboundaries from the images by certain algorithms. This inspecting system is especially effective when the thickness of the multi-crystalline silicon wafer is not constant. Furthermore, this system is also useful for controlling quality in on-line process of solar cell production.

Original language	English
Title of host publication	IEEE Sensors 2010 Conference, SENSORS 2010
Pages	494-497
Number of pages	4
DOIs	https://doi.org/10.1109/ICSENS.2010.5690149
Publication status	Published - 2010
Event	9th IEEE Sensors Conference 2010, SENSORS 2010 - Waikoloa, HI, United States Duration: 2010 Nov 1 → 2010 Nov 4

Publication series

Name	Proceedings of IEEE Sensors

Other

Other	9th IEEE Sensors Conference 2010, SENSORS 2010
Country	United States
City	Waikoloa, HI
Period	10-11-01 → 10-11-04

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering

Access to Document

10.1109/ICSENS.2010.5690149

Fingerprint Dive into the research topics of 'High-performance inspecting system for detecting micro-crack defects of solar wafer'. Together they form a unique fingerprint.

Cite this

@inproceedings{6b624dc72f634f37bb3c18c411ee9eed,

title = "High-performance inspecting system for detecting micro-crack defects of solar wafer",

abstract = "A novel inspecting system combining a tunable exposing unit for inspecting micro-cracks of solar wafers is proposed. With the infrared ray transmitting through silicon wafers, the inspecting images will be captured by a CCD camera, and the micro-crack defects from the images will be apparently appeared. So it can easier to precisely distinguish either micro-cracks or grainboundaries from the images by certain algorithms. This inspecting system is especially effective when the thickness of the multi-crystalline silicon wafer is not constant. Furthermore, this system is also useful for controlling quality in on-line process of solar cell production.",

author = "Ke, {Shun Sheng} and Lin, {Kun Wei} and Lin, {Yang Cheng} and Chen, {Jiun Ting} and Wang, {Yung Hsing} and Liu, {Chien Sheng}",

year = "2010",

doi = "10.1109/ICSENS.2010.5690149",

language = "English",

isbn = "9781424481682",

series = "Proceedings of IEEE Sensors",

pages = "494--497",

booktitle = "IEEE Sensors 2010 Conference, SENSORS 2010",

note = "9th IEEE Sensors Conference 2010, SENSORS 2010 ; Conference date: 01-11-2010 Through 04-11-2010",

}

Ke, SS, Lin, KW, Lin, YC, Chen, JT, Wang, YH & Liu, CS 2010, High-performance inspecting system for detecting micro-crack defects of solar wafer. in IEEE Sensors 2010 Conference, SENSORS 2010., 5690149, Proceedings of IEEE Sensors, pp. 494-497, 9th IEEE Sensors Conference 2010, SENSORS 2010, Waikoloa, HI, United States, 10-11-01. https://doi.org/10.1109/ICSENS.2010.5690149

High-performance inspecting system for detecting micro-crack defects of solar wafer. / Ke, Shun Sheng; Lin, Kun Wei; Lin, Yang Cheng; Chen, Jiun Ting; Wang, Yung Hsing; Liu, Chien Sheng.

IEEE Sensors 2010 Conference, SENSORS 2010. 2010. p. 494-497 5690149 (Proceedings of IEEE Sensors).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - High-performance inspecting system for detecting micro-crack defects of solar wafer

AU - Ke, Shun Sheng

AU - Lin, Kun Wei

AU - Lin, Yang Cheng

AU - Chen, Jiun Ting

AU - Wang, Yung Hsing

AU - Liu, Chien Sheng

PY - 2010

Y1 - 2010

N2 - A novel inspecting system combining a tunable exposing unit for inspecting micro-cracks of solar wafers is proposed. With the infrared ray transmitting through silicon wafers, the inspecting images will be captured by a CCD camera, and the micro-crack defects from the images will be apparently appeared. So it can easier to precisely distinguish either micro-cracks or grainboundaries from the images by certain algorithms. This inspecting system is especially effective when the thickness of the multi-crystalline silicon wafer is not constant. Furthermore, this system is also useful for controlling quality in on-line process of solar cell production.

AB - A novel inspecting system combining a tunable exposing unit for inspecting micro-cracks of solar wafers is proposed. With the infrared ray transmitting through silicon wafers, the inspecting images will be captured by a CCD camera, and the micro-crack defects from the images will be apparently appeared. So it can easier to precisely distinguish either micro-cracks or grainboundaries from the images by certain algorithms. This inspecting system is especially effective when the thickness of the multi-crystalline silicon wafer is not constant. Furthermore, this system is also useful for controlling quality in on-line process of solar cell production.

UR - http://www.scopus.com/inward/record.url?scp=79951906649&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=79951906649&partnerID=8YFLogxK

U2 - 10.1109/ICSENS.2010.5690149

DO - 10.1109/ICSENS.2010.5690149

M3 - Conference contribution

AN - SCOPUS:79951906649

SN - 9781424481682

T3 - Proceedings of IEEE Sensors

SP - 494

EP - 497

BT - IEEE Sensors 2010 Conference, SENSORS 2010

T2 - 9th IEEE Sensors Conference 2010, SENSORS 2010

Y2 - 1 November 2010 through 4 November 2010

ER -