High-performance inspecting system for detecting micro-crack defects of solar wafer

Shun Sheng Ke, Kun Wei Lin, Yang Cheng Lin, Jiun Ting Chen, Yung Hsing Wang, Chien Sheng Liu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)


A novel inspecting system combining a tunable exposing unit for inspecting micro-cracks of solar wafers is proposed. With the infrared ray transmitting through silicon wafers, the inspecting images will be captured by a CCD camera, and the micro-crack defects from the images will be apparently appeared. So it can easier to precisely distinguish either micro-cracks or grainboundaries from the images by certain algorithms. This inspecting system is especially effective when the thickness of the multi-crystalline silicon wafer is not constant. Furthermore, this system is also useful for controlling quality in on-line process of solar cell production.

Original languageEnglish
Title of host publicationIEEE Sensors 2010 Conference, SENSORS 2010
Number of pages4
Publication statusPublished - 2010
Event9th IEEE Sensors Conference 2010, SENSORS 2010 - Waikoloa, HI, United States
Duration: 2010 Nov 12010 Nov 4

Publication series

NameProceedings of IEEE Sensors


Other9th IEEE Sensors Conference 2010, SENSORS 2010
Country/TerritoryUnited States
CityWaikoloa, HI

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering


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