High performance packaging with multilayer ceramic antenna switch module for wireless communication

Wen-Shi Lee, H. Chen, C. W. Tang, J. S. Hsieh, C. Y. Su, R. Lei

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

With increasing performance and functional integration of semiconductor technology the packaging of the chips gains more important for the design of complex microelectronic system. Ceramic chip carriers are an important element of packages, which have to fit to the continuously improving semiconductor performance. Ceramic packages offer several advantages compared to conventional plastic packages. The superior thermal and mechanical properties ensure an excellent reliability. Low temperature ceramic cofiring (LTCC) is useful in the manufacture of a broad range of radio frequency components. When several basic components, such as capacitor, inductor and transmission lines are integrated into a single multilayer ceramic package, a small and more consistent circuit can be achieved. An antenna switch was constructed using LTCC. Aspects of the device construction and electrical performances are presented.

Original languageEnglish
Title of host publicationProceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages403-408
Number of pages6
ISBN (Electronic)078037682X, 9780780376823
DOIs
Publication statusPublished - 2002 Jan 1
Event4th International Symposium on Electronic Materials and Packaging, EMAP 2002 - Kaohsiung, Taiwan
Duration: 2002 Dec 42002 Dec 6

Publication series

NameProceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Other

Other4th International Symposium on Electronic Materials and Packaging, EMAP 2002
CountryTaiwan
CityKaohsiung
Period02-12-0402-12-06

Fingerprint

Packaging
Multilayers
Switches
Semiconductor materials
Antennas
Communication
Microelectronics
Electric lines
Capacitors
Thermodynamic properties
Plastics
Mechanical properties
Temperature
Networks (circuits)

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Materials Science(all)

Cite this

Lee, W-S., Chen, H., Tang, C. W., Hsieh, J. S., Su, C. Y., & Lei, R. (2002). High performance packaging with multilayer ceramic antenna switch module for wireless communication. In Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002 (pp. 403-408). [1188873] (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EMAP.2002.1188873
Lee, Wen-Shi ; Chen, H. ; Tang, C. W. ; Hsieh, J. S. ; Su, C. Y. ; Lei, R. / High performance packaging with multilayer ceramic antenna switch module for wireless communication. Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc., 2002. pp. 403-408 (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002).
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Lee, W-S, Chen, H, Tang, CW, Hsieh, JS, Su, CY & Lei, R 2002, High performance packaging with multilayer ceramic antenna switch module for wireless communication. in Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002., 1188873, Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002, Institute of Electrical and Electronics Engineers Inc., pp. 403-408, 4th International Symposium on Electronic Materials and Packaging, EMAP 2002, Kaohsiung, Taiwan, 02-12-04. https://doi.org/10.1109/EMAP.2002.1188873

High performance packaging with multilayer ceramic antenna switch module for wireless communication. / Lee, Wen-Shi; Chen, H.; Tang, C. W.; Hsieh, J. S.; Su, C. Y.; Lei, R.

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc., 2002. p. 403-408 1188873 (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Lee W-S, Chen H, Tang CW, Hsieh JS, Su CY, Lei R. High performance packaging with multilayer ceramic antenna switch module for wireless communication. In Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc. 2002. p. 403-408. 1188873. (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002). https://doi.org/10.1109/EMAP.2002.1188873