TY - JOUR
T1 - High power electronic component
T2 - Review
AU - Chen, Ping H.
AU - Chang, Shyy W.
AU - Chiang, Kuei F.
AU - Li, Ji
PY - 2008
Y1 - 2008
N2 - A large number of recent patents for cooling of high power electronic components are reviewed. Along with the progresses in the developments of material, fabrication, and packaging techniques, various single and two phase cooling devices are developed for thermal managements of electronic devices. In this respect, practical patents for heat-sink developments and implementations of nanotechnology and two-phase devices are reviewed through which the innovative concepts matching their future developing trends are disclosed.
AB - A large number of recent patents for cooling of high power electronic components are reviewed. Along with the progresses in the developments of material, fabrication, and packaging techniques, various single and two phase cooling devices are developed for thermal managements of electronic devices. In this respect, practical patents for heat-sink developments and implementations of nanotechnology and two-phase devices are reviewed through which the innovative concepts matching their future developing trends are disclosed.
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U2 - 10.2174/187221208786306270
DO - 10.2174/187221208786306270
M3 - Review article
AN - SCOPUS:58149216456
VL - 2
SP - 174
EP - 188
JO - Recent Patents on Engineering
JF - Recent Patents on Engineering
SN - 1872-2121
IS - 3
ER -