High power electronic component: Review

Ping H. Chen, Shyy W. Chang, Kuei F. Chiang, Ji Li

Research output: Contribution to journalReview articlepeer-review

30 Citations (Scopus)

Abstract

A large number of recent patents for cooling of high power electronic components are reviewed. Along with the progresses in the developments of material, fabrication, and packaging techniques, various single and two phase cooling devices are developed for thermal managements of electronic devices. In this respect, practical patents for heat-sink developments and implementations of nanotechnology and two-phase devices are reviewed through which the innovative concepts matching their future developing trends are disclosed.

Original languageEnglish
Pages (from-to)174-188
Number of pages15
JournalRecent Patents on Engineering
Volume2
Issue number3
DOIs
Publication statusPublished - 2008 Dec 1

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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