High-Power LED Chip-on-Board Packages with Diamond-Like Carbon Heat-Spreading Layers

Pai Yang Tsai; Hou Kuei Huang; Chien Min Sung; Ming Chi Kan; Yeong Her Wang

doi:10.1109/JDT.2015.2491934

High-Power LED Chip-on-Board Packages with Diamond-Like Carbon Heat-Spreading Layers

Pai Yang Tsai, Hou Kuei Huang, Chien Min Sung, Ming Chi Kan, Yeong Her Wang

Institute of Microelectronics

Research output: Contribution to journal › Article › peer-review

8 Citations (Scopus)

Abstract

The thermal properties of a flip-chip light-emitting diode (FCLED) chip-on-board (COB) with diamond-like carbon (DLC) heat-spreading layers are investigated. The temperature-dependent performance of the COB packages with and without DLC heat-spreading layers at the LED and metal core printed circuit board sites are studied. Results show that the device junction temperature and thermal conductivity of the COB package with DLC heat-spreading layers (DLC package) are less than those of the COB package without DLC heat-spreading layers (regular package). For the steady state of light intensity, the mean of light intensity drop for 12 tested packages of DLC package was improved by 6.1% after 3 hours of burn-in compared with that of the regular package.

Original language	English
Article number	7299605
Pages (from-to)	357-361
Number of pages	5
Journal	Journal of Display Technology
Volume	12
Issue number	4
DOIs	https://doi.org/10.1109/JDT.2015.2491934
Publication status	Published - 2016 Apr

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering

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10.1109/JDT.2015.2491934

Cite this

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title = "High-Power LED Chip-on-Board Packages with Diamond-Like Carbon Heat-Spreading Layers",

abstract = "The thermal properties of a flip-chip light-emitting diode (FCLED) chip-on-board (COB) with diamond-like carbon (DLC) heat-spreading layers are investigated. The temperature-dependent performance of the COB packages with and without DLC heat-spreading layers at the LED and metal core printed circuit board sites are studied. Results show that the device junction temperature and thermal conductivity of the COB package with DLC heat-spreading layers (DLC package) are less than those of the COB package without DLC heat-spreading layers (regular package). For the steady state of light intensity, the mean of light intensity drop for 12 tested packages of DLC package was improved by 6.1% after 3 hours of burn-in compared with that of the regular package.",

author = "Tsai, {Pai Yang} and Huang, {Hou Kuei} and Sung, {Chien Min} and Kan, {Ming Chi} and Wang, {Yeong Her}",

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doi = "10.1109/JDT.2015.2491934",

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AU - Tsai, Pai Yang

AU - Huang, Hou Kuei

AU - Sung, Chien Min

AU - Kan, Ming Chi

AU - Wang, Yeong Her

PY - 2016/4

Y1 - 2016/4

N2 - The thermal properties of a flip-chip light-emitting diode (FCLED) chip-on-board (COB) with diamond-like carbon (DLC) heat-spreading layers are investigated. The temperature-dependent performance of the COB packages with and without DLC heat-spreading layers at the LED and metal core printed circuit board sites are studied. Results show that the device junction temperature and thermal conductivity of the COB package with DLC heat-spreading layers (DLC package) are less than those of the COB package without DLC heat-spreading layers (regular package). For the steady state of light intensity, the mean of light intensity drop for 12 tested packages of DLC package was improved by 6.1% after 3 hours of burn-in compared with that of the regular package.

AB - The thermal properties of a flip-chip light-emitting diode (FCLED) chip-on-board (COB) with diamond-like carbon (DLC) heat-spreading layers are investigated. The temperature-dependent performance of the COB packages with and without DLC heat-spreading layers at the LED and metal core printed circuit board sites are studied. Results show that the device junction temperature and thermal conductivity of the COB package with DLC heat-spreading layers (DLC package) are less than those of the COB package without DLC heat-spreading layers (regular package). For the steady state of light intensity, the mean of light intensity drop for 12 tested packages of DLC package was improved by 6.1% after 3 hours of burn-in compared with that of the regular package.

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High-Power LED Chip-on-Board Packages with Diamond-Like Carbon Heat-Spreading Layers

Abstract

All Science Journal Classification (ASJC) codes

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