High-quality texture compression using adaptive color grouping and selection algorithm

Chun Wei Chen, Ching Heng Su, Der Wei Yang, Jonas Wang, Chia Cheng Lo, Ming-Der Shieh

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Texture compression is an important technique to reduce memory storage and increase rendering speed in graphic processing units (GPUS). To ensure fast decoding and retain random memory access characteristics, the industry standard DXTC compression finds an approximate line segment in color space for each 4×4 block. The idea has been extended to multiline solutions by segmenting the 4×4 block into several partitions and adopted by the new format BPTC. BPTC can provide the highest quality than other texture compression standards. However, the limited partition combinations used in BPTC would smooth the texture detail in some cases. This work introduces an adaptive color grouping and selection algorithm to relax the texture smoothing issue. Simulation results show that the proposed algorithm can improve the average PSNR by 0.78 dB for those blocks.

Original languageEnglish
Title of host publication2015 IEEE International Symposium on Circuits and Systems, ISCAS 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages2760-2763
Number of pages4
ISBN (Electronic)9781479983919
DOIs
Publication statusPublished - 2015 Jul 27
EventIEEE International Symposium on Circuits and Systems, ISCAS 2015 - Lisbon, Portugal
Duration: 2015 May 242015 May 27

Publication series

NameProceedings - IEEE International Symposium on Circuits and Systems
Volume2015-July
ISSN (Print)0271-4310

Other

OtherIEEE International Symposium on Circuits and Systems, ISCAS 2015
CountryPortugal
CityLisbon
Period15-05-2415-05-27

Fingerprint

Textures
Color
Data storage equipment
Decoding
Industry

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Chen, C. W., Su, C. H., Yang, D. W., Wang, J., Lo, C. C., & Shieh, M-D. (2015). High-quality texture compression using adaptive color grouping and selection algorithm. In 2015 IEEE International Symposium on Circuits and Systems, ISCAS 2015 (pp. 2760-2763). [7169258] (Proceedings - IEEE International Symposium on Circuits and Systems; Vol. 2015-July). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISCAS.2015.7169258
Chen, Chun Wei ; Su, Ching Heng ; Yang, Der Wei ; Wang, Jonas ; Lo, Chia Cheng ; Shieh, Ming-Der. / High-quality texture compression using adaptive color grouping and selection algorithm. 2015 IEEE International Symposium on Circuits and Systems, ISCAS 2015. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 2760-2763 (Proceedings - IEEE International Symposium on Circuits and Systems).
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Chen, CW, Su, CH, Yang, DW, Wang, J, Lo, CC & Shieh, M-D 2015, High-quality texture compression using adaptive color grouping and selection algorithm. in 2015 IEEE International Symposium on Circuits and Systems, ISCAS 2015., 7169258, Proceedings - IEEE International Symposium on Circuits and Systems, vol. 2015-July, Institute of Electrical and Electronics Engineers Inc., pp. 2760-2763, IEEE International Symposium on Circuits and Systems, ISCAS 2015, Lisbon, Portugal, 15-05-24. https://doi.org/10.1109/ISCAS.2015.7169258

High-quality texture compression using adaptive color grouping and selection algorithm. / Chen, Chun Wei; Su, Ching Heng; Yang, Der Wei; Wang, Jonas; Lo, Chia Cheng; Shieh, Ming-Der.

2015 IEEE International Symposium on Circuits and Systems, ISCAS 2015. Institute of Electrical and Electronics Engineers Inc., 2015. p. 2760-2763 7169258 (Proceedings - IEEE International Symposium on Circuits and Systems; Vol. 2015-July).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Chen CW, Su CH, Yang DW, Wang J, Lo CC, Shieh M-D. High-quality texture compression using adaptive color grouping and selection algorithm. In 2015 IEEE International Symposium on Circuits and Systems, ISCAS 2015. Institute of Electrical and Electronics Engineers Inc. 2015. p. 2760-2763. 7169258. (Proceedings - IEEE International Symposium on Circuits and Systems). https://doi.org/10.1109/ISCAS.2015.7169258