High-Temperature Mechanical Properties of Zn-Based High-Temperature Lead-Free Solders

Che Wei Chang, Kwang-Lung Lin

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

The effect of a minor addition of Ti on the mechanical behavior of Zn-25Sn-xTi (x = 0 wt.%, 0.02 wt.% and 0.04 wt.%) solder alloy at high temperatures of 80°C, 100°C, and 120°C was investigated. The investigation revealed that Ti acted as nucleating agent. The grain size of the Zn-25Sn alloy was significantly refined with the addition of 0.02%Ti. The Zn-25Sn-0.02Ti exhibited the greatest elongation at all test temperatures. An excess addition of Ti (more than 0.04%) was found to cause the formation of ternary TiSn4Zn5 compounds, which is correlated with the degradation of elongation. The fractographs of the solders at high temperature revealed the presence of the TiSn4Zn5 compound in the dimple bottom, indicating that voids nucleated at the particles.

Original languageEnglish
Pages (from-to)135-141
Number of pages7
JournalJournal of Electronic Materials
Volume48
Issue number1
DOIs
Publication statusPublished - 2019 Jan 15

Fingerprint

solders
mechanical properties
Soldering alloys
Mechanical properties
elongation
Elongation
Temperature
voids
grain size
degradation
Degradation
causes
Lead-free solders
temperature

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

Cite this

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High-Temperature Mechanical Properties of Zn-Based High-Temperature Lead-Free Solders. / Chang, Che Wei; Lin, Kwang-Lung.

In: Journal of Electronic Materials, Vol. 48, No. 1, 15.01.2019, p. 135-141.

Research output: Contribution to journalArticle

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