High-Temperature Mechanical Properties of Zn-Based High-Temperature Lead-Free Solders

Che Wei Chang; Kwang Lung Lin

doi:10.1007/s11664-018-6776-6

High-Temperature Mechanical Properties of Zn-Based High-Temperature Lead-Free Solders

Che Wei Chang, Kwang Lung Lin

Research output: Contribution to journal › Article › peer-review

13 Citations (Scopus)

Abstract

The effect of a minor addition of Ti on the mechanical behavior of Zn-25Sn-xTi (x = 0 wt.%, 0.02 wt.% and 0.04 wt.%) solder alloy at high temperatures of 80°C, 100°C, and 120°C was investigated. The investigation revealed that Ti acted as nucleating agent. The grain size of the Zn-25Sn alloy was significantly refined with the addition of 0.02%Ti. The Zn-25Sn-0.02Ti exhibited the greatest elongation at all test temperatures. An excess addition of Ti (more than 0.04%) was found to cause the formation of ternary TiSn₄Zn₅ compounds, which is correlated with the degradation of elongation. The fractographs of the solders at high temperature revealed the presence of the TiSn₄Zn₅ compound in the dimple bottom, indicating that voids nucleated at the particles.

Original language	English
Pages (from-to)	135-141
Number of pages	7
Journal	Journal of Electronic Materials
Volume	48
Issue number	1
DOIs	https://doi.org/10.1007/s11664-018-6776-6
Publication status	Published - 2019 Jan 15

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

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10.1007/s11664-018-6776-6

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title = "High-Temperature Mechanical Properties of Zn-Based High-Temperature Lead-Free Solders",

abstract = "The effect of a minor addition of Ti on the mechanical behavior of Zn-25Sn-xTi (x = 0 wt.%, 0.02 wt.% and 0.04 wt.%) solder alloy at high temperatures of 80°C, 100°C, and 120°C was investigated. The investigation revealed that Ti acted as nucleating agent. The grain size of the Zn-25Sn alloy was significantly refined with the addition of 0.02%Ti. The Zn-25Sn-0.02Ti exhibited the greatest elongation at all test temperatures. An excess addition of Ti (more than 0.04%) was found to cause the formation of ternary TiSn4Zn5 compounds, which is correlated with the degradation of elongation. The fractographs of the solders at high temperature revealed the presence of the TiSn4Zn5 compound in the dimple bottom, indicating that voids nucleated at the particles.",

author = "Chang, {Che Wei} and Lin, {Kwang Lung}",

note = "Funding Information: The authors thank the Ministry of Science and Technology, Republic of China (Taiwan) for the financial support of this study under MOST 104-2221-E-006-029-MY3. Publisher Copyright: {\textcopyright} 2018, The Minerals, Metals & Materials Society.",

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doi = "10.1007/s11664-018-6776-6",

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T1 - High-Temperature Mechanical Properties of Zn-Based High-Temperature Lead-Free Solders

AU - Chang, Che Wei

AU - Lin, Kwang Lung

N1 - Funding Information: The authors thank the Ministry of Science and Technology, Republic of China (Taiwan) for the financial support of this study under MOST 104-2221-E-006-029-MY3. Publisher Copyright: © 2018, The Minerals, Metals & Materials Society.

PY - 2019/1/15

Y1 - 2019/1/15

N2 - The effect of a minor addition of Ti on the mechanical behavior of Zn-25Sn-xTi (x = 0 wt.%, 0.02 wt.% and 0.04 wt.%) solder alloy at high temperatures of 80°C, 100°C, and 120°C was investigated. The investigation revealed that Ti acted as nucleating agent. The grain size of the Zn-25Sn alloy was significantly refined with the addition of 0.02%Ti. The Zn-25Sn-0.02Ti exhibited the greatest elongation at all test temperatures. An excess addition of Ti (more than 0.04%) was found to cause the formation of ternary TiSn4Zn5 compounds, which is correlated with the degradation of elongation. The fractographs of the solders at high temperature revealed the presence of the TiSn4Zn5 compound in the dimple bottom, indicating that voids nucleated at the particles.

AB - The effect of a minor addition of Ti on the mechanical behavior of Zn-25Sn-xTi (x = 0 wt.%, 0.02 wt.% and 0.04 wt.%) solder alloy at high temperatures of 80°C, 100°C, and 120°C was investigated. The investigation revealed that Ti acted as nucleating agent. The grain size of the Zn-25Sn alloy was significantly refined with the addition of 0.02%Ti. The Zn-25Sn-0.02Ti exhibited the greatest elongation at all test temperatures. An excess addition of Ti (more than 0.04%) was found to cause the formation of ternary TiSn4Zn5 compounds, which is correlated with the degradation of elongation. The fractographs of the solders at high temperature revealed the presence of the TiSn4Zn5 compound in the dimple bottom, indicating that voids nucleated at the particles.

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JO - Journal of Electronic Materials

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High-Temperature Mechanical Properties of Zn-Based High-Temperature Lead-Free Solders

Abstract

All Science Journal Classification (ASJC) codes

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