TY - JOUR
T1 - High-Temperature Mechanical Properties of Zn-Based High-Temperature Lead-Free Solders
AU - Chang, Che Wei
AU - Lin, Kwang Lung
N1 - Funding Information:
The authors thank the Ministry of Science and Technology, Republic of China (Taiwan) for the financial support of this study under MOST 104-2221-E-006-029-MY3.
Publisher Copyright:
© 2018, The Minerals, Metals & Materials Society.
PY - 2019/1/15
Y1 - 2019/1/15
N2 - The effect of a minor addition of Ti on the mechanical behavior of Zn-25Sn-xTi (x = 0 wt.%, 0.02 wt.% and 0.04 wt.%) solder alloy at high temperatures of 80°C, 100°C, and 120°C was investigated. The investigation revealed that Ti acted as nucleating agent. The grain size of the Zn-25Sn alloy was significantly refined with the addition of 0.02%Ti. The Zn-25Sn-0.02Ti exhibited the greatest elongation at all test temperatures. An excess addition of Ti (more than 0.04%) was found to cause the formation of ternary TiSn4Zn5 compounds, which is correlated with the degradation of elongation. The fractographs of the solders at high temperature revealed the presence of the TiSn4Zn5 compound in the dimple bottom, indicating that voids nucleated at the particles.
AB - The effect of a minor addition of Ti on the mechanical behavior of Zn-25Sn-xTi (x = 0 wt.%, 0.02 wt.% and 0.04 wt.%) solder alloy at high temperatures of 80°C, 100°C, and 120°C was investigated. The investigation revealed that Ti acted as nucleating agent. The grain size of the Zn-25Sn alloy was significantly refined with the addition of 0.02%Ti. The Zn-25Sn-0.02Ti exhibited the greatest elongation at all test temperatures. An excess addition of Ti (more than 0.04%) was found to cause the formation of ternary TiSn4Zn5 compounds, which is correlated with the degradation of elongation. The fractographs of the solders at high temperature revealed the presence of the TiSn4Zn5 compound in the dimple bottom, indicating that voids nucleated at the particles.
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U2 - 10.1007/s11664-018-6776-6
DO - 10.1007/s11664-018-6776-6
M3 - Article
AN - SCOPUS:85056305120
VL - 48
SP - 135
EP - 141
JO - Journal of Electronic Materials
JF - Journal of Electronic Materials
SN - 0361-5235
IS - 1
ER -