High thermal conductivity epoxy molding compound filled with a combustion synthesized AIN powder

Cheng Yu Hsieh, Shyan-Lung Chung

Research output: Contribution to journalArticle

87 Citations (Scopus)

Abstract

A combustion synthesized AIN powder was studied for its feasibility as a filler for epoxy molding compound (EMC) and effects of various experimental parameters on the thermal conductivity and moisture resistance of the EMC were investigated. The AIN powder was coated with silane both to increase the moisture resistance of the EMC and to enhance the bonding between the filler AIN and the matrix resin. The thermal conductivity could be significantly increased by using AIN powders with large particle sizes and this was considered to be due to a reduction in interface area between the AIN particles and the matrix resin. A thermal conductivity of 14 W/mK was obtained when the EMC was fabricated by a process involving no use of a solvent and a AIN powder with a particle size of 35.3 μm and a filler content of 67 vol % were used.

Original languageEnglish
Pages (from-to)4734-4740
Number of pages7
JournalJournal of Applied Polymer Science
Volume102
Issue number5
DOIs
Publication statusPublished - 2006 Dec 5

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Sheet molding compounds
Powders
Thermal conductivity
Fillers
Moisture
Resins
Particle size
Silanes

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Surfaces, Coatings and Films
  • Polymers and Plastics
  • Materials Chemistry

Cite this

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High thermal conductivity epoxy molding compound filled with a combustion synthesized AIN powder. / Hsieh, Cheng Yu; Chung, Shyan-Lung.

In: Journal of Applied Polymer Science, Vol. 102, No. 5, 05.12.2006, p. 4734-4740.

Research output: Contribution to journalArticle

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