High thermal dissipation of ultra high power light-emitting diodes by copper electroplating

Kuan Chun Chen, Wen-Kuei Chuang, Y. K. Su, C. L. Lin, Hsiao Chiu Hsu, J. Q. Huango, K. F. Yang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

19 Citations (Scopus)

Abstract

The thermal management, has become increasingly important when comes to device applications using ultra high power light emitting diodes (UHPLEDs). To thermally manage the devices in a most effective fashion, we report a novel packaging technique in which a copper electroplating process is directly applied over the red, green, and blue LED chips. With the copper-encapsulated layer, the operation current subsequently administered to these LED chips can be increased easily from a conventional 350 mA to more than 1050 mA stable at room temperature. This process can be well adapted to AlInGaP-based red LED when its working current can be driven all the way up to 1650mA. At 350 mA, the relative luminous intensity of these specially packaged red, green, and blue LEDs (RGB LEDs) clearly demonstrate a corresponding enhancement of 53%, 69%, and 23% when compared to those of conventionally packaged LEDs. Furthermore, as the injection current of these LED chips increases to 850mA, the respective improvement in relative luminous intensity of these RGB LEDs chips becomes 431%, 83%, and 18%, when compared to those of the conventional packaged devices.

Original languageEnglish
Title of host publicationProceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07
Pages734-736
Number of pages3
DOIs
Publication statusPublished - 2007 Oct 22
Event57th Electronic Components and Technology Conference 2007, ECTC '07 - Sparks, NV, United States
Duration: 2007 May 292007 Jun 1

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other57th Electronic Components and Technology Conference 2007, ECTC '07
Country/TerritoryUnited States
CitySparks, NV
Period07-05-2907-06-01

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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