High thermal stability and wide angle of white light chip-on-board package using a remote phosphor structure

Pai Yang Tsai, Hou Kuei Huang, Jian Min Sung, Ming Chi Kan, Yeong-Her Wang

Research output: Contribution to journalArticle

14 Citations (Scopus)

Abstract

High thermal stability and wide angle of a white light chip-on-board package using a remote phosphor structure was investigated. The junction and phosphor layer temperatures of the remote phosphor structure are lower than those of the conventional phosphor structure. Compared with the conventional structure, the luminous flux and luminous efficiency of the proposed phosphor structure are improved by more than 10% at an injection current of 1 A in the continuous wave mode. For the color temperature shift, the remote phosphor structure is more stable than the conventional one. In the radiation pattern, the remote phosphor structure is improved over 40°. Consequently, the remote phosphor structure is more suitable than the conventional phosphor structure in thermal stability and wide-angle lighting application.

Original languageEnglish
Article number7004034
Pages (from-to)250-252
Number of pages3
JournalIEEE Electron Device Letters
Volume36
Issue number3
DOIs
Publication statusPublished - 2015 Mar 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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