@inproceedings{6d6db807c6a84c52bde69317e911a909,
title = "High thermal stability Cu-to-Cu joints fabricated by using Ga-based paste",
abstract = "We propose an approach for fabricating face- centered cubic (fcc) solid-solution Cu-to-Cu joints without formation of intermetallic compounds (IMCs) by using a trace amount of Ga-based paste and Ni under-bump metallurgy at 300 °C in air for 30 minutes. The Cu/Ni/Ga/Ni/Cu sandwich couple fully transformed into the Cu/fcc-(Ni,Cu,Ga)/Cu joint after bonding. We demonstrate the fabrication method for an IMC-free, and thermally stable Cu-to-Cu joints by using the self-made Ga-based paste. This technology is potential for high- power electronics packaging applications and has been patented in the United States (US10213986B2), Japan (6290156), China (ZL201510735735.3), and Republic of China (I667758).",
author = "Huang, {Tzu Hsuan} and Liu, {Yu Chen} and Cheng, {Cheng En} and Huang, {Chien Wei} and Yang, {Chih Han} and Lin, {Chih Feng} and Wang, {Cheng Chi} and Lin, {Shih Kang}",
note = "Publisher Copyright: {\textcopyright} 2022 Japan Institute of Electronics Packaging.; 21st International Conference on Electronics Packaging, ICEP 2022 ; Conference date: 11-05-2022 Through 14-05-2022",
year = "2022",
doi = "10.23919/ICEP55381.2022.9795581",
language = "English",
series = "2022 International Conference on Electronics Packaging, ICEP 2022",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "127--128",
booktitle = "2022 International Conference on Electronics Packaging, ICEP 2022",
address = "United States",
}