How to enhance Sn-Bi low-temperature solder by alloying?

Shih Kang Lin; Chih Han Yang; Yu Chen Liu; Yuki Hirata; Hiroshi Nishikawa

doi:10.23919/ICEP58572.2023.10129679

How to enhance Sn-Bi low-temperature solder by alloying?

Shih Kang Lin, Chih Han Yang, Yu Chen Liu, Yuki Hirata, Hiroshi Nishikawa

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Citations (Scopus)

Abstract

Low-temperature Pb-free solders are in demand to alleviate the warpage issue for high-density fine-pitch packaging. We designed a low-temperature tin-bismuth-silver Sn-Bi-Ag solder by CALculation of PHAse Diagram-type thermodynamic calculations using the PANDAT software and performed corresponding key experiments. The goal is to improve Sn-Bi solder's mechanical properties while keeping their low melting temperatures. The DSC measurement shows the solidus of Sn-Bi-Ag was 135.0 °C. Higher (Sn) phase fraction, low IMC fraction, and low IMC, finer (Sn) + (Bi) eutectic spacing of Sn-Bi-Ag led to the high yield strength, high ultimate tensile strength, toughness, and better elongation in as-cast after the tensile test. Furtherly, we found Ag and Sn doping in (Bi) polycrystals induced tensile stress in the (Bi) lattice and it led to the different solution effects in each (Bi) orientation. It could alleviate the anisotropic mechanical properties of (Bi) and avoid concentrated force on the weak grains.

Original language	English
Title of host publication	2023 International Conference on Electronics Packaging, ICEP 2023
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	53-54
Number of pages	2
ISBN (Electronic)	9784991191152
DOIs	https://doi.org/10.23919/ICEP58572.2023.10129679
Publication status	Published - 2023
Event	22nd International Conference on Electronics Packaging, ICEP 2023 - Kumamoto, Japan Duration: 2023 Apr 19 → 2023 Apr 22

Publication series

Name	2023 International Conference on Electronics Packaging, ICEP 2023

Conference

Conference	22nd International Conference on Electronics Packaging, ICEP 2023
Country/Territory	Japan
City	Kumamoto
Period	23-04-19 → 23-04-22

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering
Industrial and Manufacturing Engineering
Mechanics of Materials
Safety, Risk, Reliability and Quality
Electronic, Optical and Magnetic Materials

Access to Document

10.23919/ICEP58572.2023.10129679

Cite this

Lin, S. K., Yang, C. H., Liu, Y. C., Hirata, Y., & Nishikawa, H. (2023). How to enhance Sn-Bi low-temperature solder by alloying? In 2023 International Conference on Electronics Packaging, ICEP 2023 (pp. 53-54). (2023 International Conference on Electronics Packaging, ICEP 2023). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/ICEP58572.2023.10129679

@inproceedings{7e1ebae4570845df89a5f56a3460d0d0,

title = "How to enhance Sn-Bi low-temperature solder by alloying?",

abstract = "Low-temperature Pb-free solders are in demand to alleviate the warpage issue for high-density fine-pitch packaging. We designed a low-temperature tin-bismuth-silver Sn-Bi-Ag solder by CALculation of PHAse Diagram-type thermodynamic calculations using the PANDAT software and performed corresponding key experiments. The goal is to improve Sn-Bi solder's mechanical properties while keeping their low melting temperatures. The DSC measurement shows the solidus of Sn-Bi-Ag was 135.0 °C. Higher (Sn) phase fraction, low IMC fraction, and low IMC, finer (Sn) + (Bi) eutectic spacing of Sn-Bi-Ag led to the high yield strength, high ultimate tensile strength, toughness, and better elongation in as-cast after the tensile test. Furtherly, we found Ag and Sn doping in (Bi) polycrystals induced tensile stress in the (Bi) lattice and it led to the different solution effects in each (Bi) orientation. It could alleviate the anisotropic mechanical properties of (Bi) and avoid concentrated force on the weak grains.",

author = "Lin, {Shih Kang} and Yang, {Chih Han} and Liu, {Yu Chen} and Yuki Hirata and Hiroshi Nishikawa",

note = "Funding Information: ACKNOWLEDGMENT The authors gratefully acknowledge the financial supports from the Ministry of Science and Technology (MOST) in Taiwan (109-3111-8-006-001, 110-2622-8-006-017-SB, 110-2636-E-006-016, 111-2636-E-006-018, and 110-2222-E-006-008). This work was also partially supported by the Hierarchical Green-Energy Materials (Hi-GEM) Research Center, from The Featured Areas Research Center Program within the framework of the Higher Education Sprout Project by the Ministry of Education (MOE) and MOST (111-2634-F-006-008) in Taiwan. Publisher Copyright: {\textcopyright} 2023 Japan Institute of Electronics Packaging.; 22nd International Conference on Electronics Packaging, ICEP 2023 ; Conference date: 19-04-2023 Through 22-04-2023",

year = "2023",

doi = "10.23919/ICEP58572.2023.10129679",

language = "English",

series = "2023 International Conference on Electronics Packaging, ICEP 2023",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "53--54",

booktitle = "2023 International Conference on Electronics Packaging, ICEP 2023",

address = "United States",

}

Lin, SK, Yang, CH, Liu, YC, Hirata, Y & Nishikawa, H 2023, How to enhance Sn-Bi low-temperature solder by alloying? in 2023 International Conference on Electronics Packaging, ICEP 2023. 2023 International Conference on Electronics Packaging, ICEP 2023, Institute of Electrical and Electronics Engineers Inc., pp. 53-54, 22nd International Conference on Electronics Packaging, ICEP 2023, Kumamoto, Japan, 23-04-19. https://doi.org/10.23919/ICEP58572.2023.10129679

How to enhance Sn-Bi low-temperature solder by alloying? / Lin, Shih Kang; Yang, Chih Han; Liu, Yu Chen et al.
2023 International Conference on Electronics Packaging, ICEP 2023. Institute of Electrical and Electronics Engineers Inc., 2023. p. 53-54 (2023 International Conference on Electronics Packaging, ICEP 2023).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution