Hybrid solder-adhesive bonding using simple resin planarization technique for 3D LSI

Masatsugu Nimura; Katsuyuki Sakuma; Hiroshi Ogino; Tomoyuki Enomoto; Akitsu Shigetou; Shuichi Shoji; Jun Mizuno

doi:10.1109/LTB-3D.2012.6238052

Hybrid solder-adhesive bonding using simple resin planarization technique for 3D LSI

Masatsugu Nimura, Katsuyuki Sakuma, Hiroshi Ogino, Tomoyuki Enomoto, Akitsu Shigetou, Shuichi Shoji, Jun Mizuno

Program on Smart and Sustainable Manufacturing

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

This paper describes hybrid solder-adhesive bonding using simple resin planarization technique for three dimensional (3D) large scale integrated circuit (LSI). The resin planarization technique is effective to remove resin on the bump surface. The results of hybrid bonding show that chip bonding and underfilling of narrow gap was achieved at same time.

Original language	English
Title of host publication	Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
Pages	81
Number of pages	1
DOIs	https://doi.org/10.1109/LTB-3D.2012.6238052
Publication status	Published - 2012
Event	2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 - Tokyo, Japan Duration: 2012 May 22 → 2012 May 23

Publication series

Name	Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012

Conference

Conference	2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
Country/Territory	Japan
City	Tokyo
Period	12-05-22 → 12-05-23

All Science Journal Classification (ASJC) codes

Computer Graphics and Computer-Aided Design
Computer Vision and Pattern Recognition

Access to Document

10.1109/LTB-3D.2012.6238052

Cite this

Nimura, M., Sakuma, K., Ogino, H., Enomoto, T., Shigetou, A., Shoji, S., & Mizuno, J. (2012). Hybrid solder-adhesive bonding using simple resin planarization technique for 3D LSI. In Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 (pp. 81). Article 6238052 (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012). https://doi.org/10.1109/LTB-3D.2012.6238052

Nimura, Masatsugu ; Sakuma, Katsuyuki ; Ogino, Hiroshi et al. / Hybrid solder-adhesive bonding using simple resin planarization technique for 3D LSI. Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. 2012. pp. 81 (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012).

@inproceedings{b9c281e67f7c45d7952a1e89389a7e42,

title = "Hybrid solder-adhesive bonding using simple resin planarization technique for 3D LSI",

abstract = "This paper describes hybrid solder-adhesive bonding using simple resin planarization technique for three dimensional (3D) large scale integrated circuit (LSI). The resin planarization technique is effective to remove resin on the bump surface. The results of hybrid bonding show that chip bonding and underfilling of narrow gap was achieved at same time.",

author = "Masatsugu Nimura and Katsuyuki Sakuma and Hiroshi Ogino and Tomoyuki Enomoto and Akitsu Shigetou and Shuichi Shoji and Jun Mizuno",

year = "2012",

doi = "10.1109/LTB-3D.2012.6238052",

language = "English",

isbn = "9781467307420",

series = "Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012",

pages = "81",

booktitle = "Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012",

note = "2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 ; Conference date: 22-05-2012 Through 23-05-2012",

}

Nimura, M, Sakuma, K, Ogino, H, Enomoto, T, Shigetou, A, Shoji, S & Mizuno, J 2012, Hybrid solder-adhesive bonding using simple resin planarization technique for 3D LSI. in Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012., 6238052, Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012, pp. 81, 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012, Tokyo, Japan, 12-05-22. https://doi.org/10.1109/LTB-3D.2012.6238052

Hybrid solder-adhesive bonding using simple resin planarization technique for 3D LSI. / Nimura, Masatsugu; Sakuma, Katsuyuki; Ogino, Hiroshi et al.
Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. 2012. p. 81 6238052 (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AU - Nimura, Masatsugu

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AU - Shoji, Shuichi

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AB - This paper describes hybrid solder-adhesive bonding using simple resin planarization technique for three dimensional (3D) large scale integrated circuit (LSI). The resin planarization technique is effective to remove resin on the bump surface. The results of hybrid bonding show that chip bonding and underfilling of narrow gap was achieved at same time.

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Nimura M, Sakuma K, Ogino H, Enomoto T, Shigetou A, Shoji S et al. Hybrid solder-adhesive bonding using simple resin planarization technique for 3D LSI. In Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. 2012. p. 81. 6238052. (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012). doi: 10.1109/LTB-3D.2012.6238052

Hybrid solder-adhesive bonding using simple resin planarization technique for 3D LSI

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