Identification of curing kinetics of epoxy molding compounds and mold flow analysis for assessment of die-shift defects

C. L. Hsiao, C. Y. Yang, H. C. Chen, Tian-Shiang Yang, Kuo-Shen Chen, T. H. Wu, Y. C. Wang, S. Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Fan-out processes are widely used in advanced packaging technologies to accommodate broader size variations and functional combinations of dies deployed on reconstituted wafers. However, such a process generates numerous mechanical loadings during the molding and curing phases. Without careful planning, failures such as 'die shift' and 'fly die' are frequently reported, which cause serious problems for subsequent processing. Among these issues, shear stress generation during molding, which is dominated by the resulted pressure distribution and increase in the viscosity of molding compound due to curing, has been recognized as a major controlling factor for defects of die shift and fly die. Prompted by the need to predict defects beforehand, this work presents an accurate 3D model for mold flow analysis by accounting for the curing kinetics. In conjunction with finite element structural analysis, the die shift induced by mold flow is estimated, and the results compare favorably with fabrication plant observations.

Original languageEnglish
Title of host publicationIMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings
PublisherIEEE Computer Society
Pages42-45
Number of pages4
ISBN (Electronic)9781538647196
DOIs
Publication statusPublished - 2017 Jul 1
Event12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2017 - Taipei, Taiwan
Duration: 2017 Oct 252017 Oct 27

Publication series

NameProceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
Volume2017-October
ISSN (Print)2150-5934
ISSN (Electronic)2150-5942

Other

Other12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2017
CountryTaiwan
CityTaipei
Period17-10-2517-10-27

Fingerprint

Sheet molding compounds
Curing
Defects
Kinetics
Molding
Structural analysis
Pressure distribution
Fans
Shear stress
Packaging
Viscosity
Planning
Fabrication
Processing

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Hsiao, C. L., Yang, C. Y., Chen, H. C., Yang, T-S., Chen, K-S., Wu, T. H., ... Lee, S. (2017). Identification of curing kinetics of epoxy molding compounds and mold flow analysis for assessment of die-shift defects. In IMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings (pp. 42-45). (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; Vol. 2017-October). IEEE Computer Society. https://doi.org/10.1109/IMPACT.2017.8255932
Hsiao, C. L. ; Yang, C. Y. ; Chen, H. C. ; Yang, Tian-Shiang ; Chen, Kuo-Shen ; Wu, T. H. ; Wang, Y. C. ; Lee, S. / Identification of curing kinetics of epoxy molding compounds and mold flow analysis for assessment of die-shift defects. IMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings. IEEE Computer Society, 2017. pp. 42-45 (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).
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abstract = "Fan-out processes are widely used in advanced packaging technologies to accommodate broader size variations and functional combinations of dies deployed on reconstituted wafers. However, such a process generates numerous mechanical loadings during the molding and curing phases. Without careful planning, failures such as 'die shift' and 'fly die' are frequently reported, which cause serious problems for subsequent processing. Among these issues, shear stress generation during molding, which is dominated by the resulted pressure distribution and increase in the viscosity of molding compound due to curing, has been recognized as a major controlling factor for defects of die shift and fly die. Prompted by the need to predict defects beforehand, this work presents an accurate 3D model for mold flow analysis by accounting for the curing kinetics. In conjunction with finite element structural analysis, the die shift induced by mold flow is estimated, and the results compare favorably with fabrication plant observations.",
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Hsiao, CL, Yang, CY, Chen, HC, Yang, T-S, Chen, K-S, Wu, TH, Wang, YC & Lee, S 2017, Identification of curing kinetics of epoxy molding compounds and mold flow analysis for assessment of die-shift defects. in IMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings. Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, vol. 2017-October, IEEE Computer Society, pp. 42-45, 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2017, Taipei, Taiwan, 17-10-25. https://doi.org/10.1109/IMPACT.2017.8255932

Identification of curing kinetics of epoxy molding compounds and mold flow analysis for assessment of die-shift defects. / Hsiao, C. L.; Yang, C. Y.; Chen, H. C.; Yang, Tian-Shiang; Chen, Kuo-Shen; Wu, T. H.; Wang, Y. C.; Lee, S.

IMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings. IEEE Computer Society, 2017. p. 42-45 (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; Vol. 2017-October).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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AB - Fan-out processes are widely used in advanced packaging technologies to accommodate broader size variations and functional combinations of dies deployed on reconstituted wafers. However, such a process generates numerous mechanical loadings during the molding and curing phases. Without careful planning, failures such as 'die shift' and 'fly die' are frequently reported, which cause serious problems for subsequent processing. Among these issues, shear stress generation during molding, which is dominated by the resulted pressure distribution and increase in the viscosity of molding compound due to curing, has been recognized as a major controlling factor for defects of die shift and fly die. Prompted by the need to predict defects beforehand, this work presents an accurate 3D model for mold flow analysis by accounting for the curing kinetics. In conjunction with finite element structural analysis, the die shift induced by mold flow is estimated, and the results compare favorably with fabrication plant observations.

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Hsiao CL, Yang CY, Chen HC, Yang T-S, Chen K-S, Wu TH et al. Identification of curing kinetics of epoxy molding compounds and mold flow analysis for assessment of die-shift defects. In IMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings. IEEE Computer Society. 2017. p. 42-45. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT). https://doi.org/10.1109/IMPACT.2017.8255932