Abstract
Fan-out processes are widely used in advanced packaging technologies to accommodate broader size variations and functional combinations of dies deployed on reconstituted wafers. However, such a process generates numerous mechanical loadings during the molding and curing phases. Without careful planning, failures such as 'die shift' and 'fly die' are frequently reported, which cause serious problems for subsequent processing. Among these issues, shear stress generation during molding, which is dominated by the resulted pressure distribution and increase in the viscosity of molding compound due to curing, has been recognized as a major controlling factor for defects of die shift and fly die. Prompted by the need to predict defects beforehand, this work presents an accurate 3D model for mold flow analysis by accounting for the curing kinetics. In conjunction with finite element structural analysis, the die shift induced by mold flow is estimated, and the results compare favorably with fabrication plant observations.
| Original language | English |
|---|---|
| Title of host publication | IMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings |
| Publisher | IEEE Computer Society |
| Pages | 42-45 |
| Number of pages | 4 |
| ISBN (Electronic) | 9781538647196 |
| DOIs | |
| Publication status | Published - 2017 Jul 1 |
| Event | 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2017 - Taipei, Taiwan Duration: 2017 Oct 25 → 2017 Oct 27 |
Publication series
| Name | Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT |
|---|---|
| Volume | 2017-October |
| ISSN (Print) | 2150-5934 |
| ISSN (Electronic) | 2150-5942 |
Other
| Other | 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2017 |
|---|---|
| Country | Taiwan |
| City | Taipei |
| Period | 17-10-25 → 17-10-27 |
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All Science Journal Classification (ASJC) codes
- Hardware and Architecture
- Control and Systems Engineering
- Electrical and Electronic Engineering
Cite this
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Identification of curing kinetics of epoxy molding compounds and mold flow analysis for assessment of die-shift defects. / Hsiao, C. L.; Yang, C. Y.; Chen, H. C.; Yang, Tian-Shiang; Chen, Kuo-Shen; Wu, T. H.; Wang, Y. C.; Lee, S.
IMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings. IEEE Computer Society, 2017. p. 42-45 (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; Vol. 2017-October).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Identification of curing kinetics of epoxy molding compounds and mold flow analysis for assessment of die-shift defects
AU - Hsiao, C. L.
AU - Yang, C. Y.
AU - Chen, H. C.
AU - Yang, Tian-Shiang
AU - Chen, Kuo-Shen
AU - Wu, T. H.
AU - Wang, Y. C.
AU - Lee, S.
PY - 2017/7/1
Y1 - 2017/7/1
N2 - Fan-out processes are widely used in advanced packaging technologies to accommodate broader size variations and functional combinations of dies deployed on reconstituted wafers. However, such a process generates numerous mechanical loadings during the molding and curing phases. Without careful planning, failures such as 'die shift' and 'fly die' are frequently reported, which cause serious problems for subsequent processing. Among these issues, shear stress generation during molding, which is dominated by the resulted pressure distribution and increase in the viscosity of molding compound due to curing, has been recognized as a major controlling factor for defects of die shift and fly die. Prompted by the need to predict defects beforehand, this work presents an accurate 3D model for mold flow analysis by accounting for the curing kinetics. In conjunction with finite element structural analysis, the die shift induced by mold flow is estimated, and the results compare favorably with fabrication plant observations.
AB - Fan-out processes are widely used in advanced packaging technologies to accommodate broader size variations and functional combinations of dies deployed on reconstituted wafers. However, such a process generates numerous mechanical loadings during the molding and curing phases. Without careful planning, failures such as 'die shift' and 'fly die' are frequently reported, which cause serious problems for subsequent processing. Among these issues, shear stress generation during molding, which is dominated by the resulted pressure distribution and increase in the viscosity of molding compound due to curing, has been recognized as a major controlling factor for defects of die shift and fly die. Prompted by the need to predict defects beforehand, this work presents an accurate 3D model for mold flow analysis by accounting for the curing kinetics. In conjunction with finite element structural analysis, the die shift induced by mold flow is estimated, and the results compare favorably with fabrication plant observations.
UR - http://www.scopus.com/inward/record.url?scp=85045141410&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85045141410&partnerID=8YFLogxK
U2 - 10.1109/IMPACT.2017.8255932
DO - 10.1109/IMPACT.2017.8255932
M3 - Conference contribution
AN - SCOPUS:85045141410
T3 - Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
SP - 42
EP - 45
BT - IMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings
PB - IEEE Computer Society
ER -