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Identification of curing kinetics of epoxy molding compounds and mold flow analysis for assessment of die-shift defects
C. L. Hsiao, C. Y. Yang, H. C. Chen, T. S. Yang, K. S. Chen, T. H. Wu, Y. C. Wang, S. Lee
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
5
Citations
(Scopus)