The effects of particle size within the chemical mechanical polishing (CMP) process are investigated using a microcontact wear model which considers the particle effects between the polishing interface during load balancing. The present theoretical results are in good agreement with the experimental data published previously. The current study provides a detailed understanding of the effects of the abrasive particles from an interfacial perspective.
All Science Journal Classification (ASJC) codes
- Chemical Engineering(all)
- Materials Science(all)
- Physical and Theoretical Chemistry
- Electrical and Electronic Engineering