Impact of Abrasive Particles on the Material Removal Rate in CMP: A Microcontact Perspective

Yeau Ren Jeng, Pay Yau Huang

Research output: Contribution to journalArticlepeer-review

34 Citations (Scopus)

Abstract

The effects of particle size within the chemical mechanical polishing (CMP) process are investigated using a microcontact wear model which considers the particle effects between the polishing interface during load balancing. The present theoretical results are in good agreement with the experimental data published previously. The current study provides a detailed understanding of the effects of the abrasive particles from an interfacial perspective.

Original languageEnglish
Pages (from-to)G40-G43
JournalElectrochemical and Solid-State Letters
Volume7
Issue number2
DOIs
Publication statusPublished - 2004 Apr 8

All Science Journal Classification (ASJC) codes

  • Chemical Engineering(all)
  • Materials Science(all)
  • Physical and Theoretical Chemistry
  • Electrochemistry
  • Electrical and Electronic Engineering

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