Improved design of thermal-via structures and circuit parameters for advanced collector-up HBTs as miniature high-power amplifiers

Hsien Cheng Tseng, Pei Hsuan Lee, Jung Hua Chou

Research output: Contribution to journalArticlepeer-review

6 Citations (Scopus)

Abstract

An improved methodology, based on the genetic algorithm, is developed to design thermal-via structures and circuit parameters of advanced InGaP and InGaAs collector-up heterojunction bipolar transistors (C-up HBTs), which are promising miniature high-power amplifiers (HPAs) in cellular communication systems. Excellent simulated and measured results demonstrate the usefulness of this technique.

Original languageEnglish
Pages (from-to)539-542
Number of pages4
JournalIEICE Transactions on Electronics
VolumeE90-C
Issue number2
DOIs
Publication statusPublished - 2007 Feb

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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