Improvement in the properties of Sn-Zn eutectic based Pb-free solder

Kwang-Lung Lin, Kang I. Chen, Hui Min Hsu, Chia Ling Shi

Research output: Contribution to journalArticlepeer-review

17 Citations (Scopus)

Abstract

Legislative action in Europe is expected to ban the use of Pb-containing product by 2006. Sn-Zn system is a possible alternative in view of its even lower melting temperature, yet problems such as oxidation and flux systems remain to be solved. This article discusses recent investigations on improving the properties of Sn-Zn solders. Subjects to be discussed include oxidation resistance, wettability, and mechanical properties.

Original languageEnglish
Pages (from-to)658-663
Number of pages6
JournalProceedings - Electronic Components and Technology Conference
Publication statusPublished - 2003

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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