Legislative action in Europe is expected to ban the use of Pb-containing product by 2006. Sn-Zn system is a possible alternative in view of its even lower melting temperature, yet problems such as oxidation and flux systems remain to be solved. This article discusses recent investigations on improving the properties of Sn-Zn solders. Subjects to be discussed include oxidation resistance, wettability, and mechanical properties.
|Number of pages||6|
|Journal||Proceedings - Electronic Components and Technology Conference|
|Publication status||Published - 2003|
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering