Improvement of Material Removal Rate and Within Wafer Non-Uniformity in Chemical Mechanical Polishing Using Computational Fluid Dynamic Modeling

  • Hafiz M. Irfan
  • , Cheng Yu Lee
  • , Debayan Mazumdar
  • , Yashar Aryanfar
  • , Wei Wu

Research output: Contribution to journal › Article › peer-review

5 Citations (Scopus)

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Engineering