Improvements in mechanical properties of Sn–Bi alloys with addition of Zn and In

Yuki Hirata; Chih han Yang; Shih kang Lin; Hiroshi Nishikawa

doi:10.1016/j.msea.2021.141131

Improvements in mechanical properties of Sn–Bi alloys with addition of Zn and In

Yuki Hirata, Chih han Yang, Shih kang Lin, Hiroshi Nishikawa

Department of Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

42 Citations (Scopus)

Abstract

In order to improve the mechanical properties after thermal aging of an Sn–45Bi–2.6Zn (SBZ) alloy, which we had proposed in a previous study, in this study, we prepared Sn–Bi–Zn–In alloys and investigated the effects of the addition of In and Zn on their microstructure and mechanical properties before and after thermal aging. We found that the addition of In suppressed the microstructural coarsening of SBZ during thermal aging and can potentially help reduce the brittleness of Sn–Bi alloys. Moreover, the addition of In had significant effect on the elongation of SBZ. We theorized that the segregation of Zn at the Sn/Bi phase boundary and the formation of a solid solution of In in the Sn phase are responsible for this result. Thus, the investigated alloys have potential for use as lead-free solder materials in the electronics industry.

Original language	English
Article number	141131
Journal	Materials Science and Engineering A
Volume	813
DOIs	https://doi.org/10.1016/j.msea.2021.141131
Publication status	Published - 2021 May 5

All Science Journal Classification (ASJC) codes

General Materials Science
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

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10.1016/j.msea.2021.141131

Cite this

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title = "Improvements in mechanical properties of Sn–Bi alloys with addition of Zn and In",

abstract = "In order to improve the mechanical properties after thermal aging of an Sn–45Bi–2.6Zn (SBZ) alloy, which we had proposed in a previous study, in this study, we prepared Sn–Bi–Zn–In alloys and investigated the effects of the addition of In and Zn on their microstructure and mechanical properties before and after thermal aging. We found that the addition of In suppressed the microstructural coarsening of SBZ during thermal aging and can potentially help reduce the brittleness of Sn–Bi alloys. Moreover, the addition of In had significant effect on the elongation of SBZ. We theorized that the segregation of Zn at the Sn/Bi phase boundary and the formation of a solid solution of In in the Sn phase are responsible for this result. Thus, the investigated alloys have potential for use as lead-free solder materials in the electronics industry.",

author = "Yuki Hirata and Yang, {Chih han} and Lin, {Shih kang} and Hiroshi Nishikawa",

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T1 - Improvements in mechanical properties of Sn–Bi alloys with addition of Zn and In

AU - Hirata, Yuki

AU - Yang, Chih han

AU - Lin, Shih kang

AU - Nishikawa, Hiroshi

PY - 2021/5/5

Y1 - 2021/5/5

N2 - In order to improve the mechanical properties after thermal aging of an Sn–45Bi–2.6Zn (SBZ) alloy, which we had proposed in a previous study, in this study, we prepared Sn–Bi–Zn–In alloys and investigated the effects of the addition of In and Zn on their microstructure and mechanical properties before and after thermal aging. We found that the addition of In suppressed the microstructural coarsening of SBZ during thermal aging and can potentially help reduce the brittleness of Sn–Bi alloys. Moreover, the addition of In had significant effect on the elongation of SBZ. We theorized that the segregation of Zn at the Sn/Bi phase boundary and the formation of a solid solution of In in the Sn phase are responsible for this result. Thus, the investigated alloys have potential for use as lead-free solder materials in the electronics industry.

AB - In order to improve the mechanical properties after thermal aging of an Sn–45Bi–2.6Zn (SBZ) alloy, which we had proposed in a previous study, in this study, we prepared Sn–Bi–Zn–In alloys and investigated the effects of the addition of In and Zn on their microstructure and mechanical properties before and after thermal aging. We found that the addition of In suppressed the microstructural coarsening of SBZ during thermal aging and can potentially help reduce the brittleness of Sn–Bi alloys. Moreover, the addition of In had significant effect on the elongation of SBZ. We theorized that the segregation of Zn at the Sn/Bi phase boundary and the formation of a solid solution of In in the Sn phase are responsible for this result. Thus, the investigated alloys have potential for use as lead-free solder materials in the electronics industry.

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JO - Materials Science and Engineering A

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M1 - 141131

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Improvements in mechanical properties of Sn–Bi alloys with addition of Zn and In

Abstract

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