Improving high-temperature oxidation behaviour of Sn-Zn-Ag-Al-Ga solders

T. K. Yeh, Kwang-Lung Lin, B. Salam

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

Purpose - The purpose of this paper is to study the influence of silver on the high-temperature oxidation behaviour of the Sn-8.5Zn-ITx/ITAg-0.01Al-0.1Ga (ITx/IT=0, 0.1, 0.3 and 0.5) solder alloys. Design/methodology/approach - The weight gains of the studied solders are measured using thermal gravimetric analyzers (TGA) at temperatures of 250, 300, 350 and 400C. The weight gains measured are used to compare the oxidation behaviour of the studied solders. The surfaces of the solders are also analyzed with Auger emission spectroscopy (AES) depth profiling and thin-film X-ray diffractometry (thin-film XRD) to identify the elements present on the surface of the studied solders. Findings - The TGA results show that the weight gains decrease with increasing silver content in the studied solders. It meant that increasing silver content could help improve the high-temperature oxidation behaviour of the studied solder. AES and thin-film XRD confirm that the formed oxide layers on the surface of the studied solder are Zn-based oxide layers. Originality/value - The findings of this paper will help provide an understanding of the effects of silver on Sn-8.5Zn-ITx/ITAg-0.01Al-0.1Ga solder.

Original languageEnglish
Pages (from-to)19-23
Number of pages5
JournalSoldering and Surface Mount Technology
Volume21
Issue number4
DOIs
Publication statusPublished - 2009 Sep 18

Fingerprint

Thermooxidation
solders
Soldering alloys
oxidation
Silver
silver
Emission spectroscopy
Oxides
X ray diffraction analysis
analyzers
Thin films
oxides
Depth profiling
thin films
spectroscopy
x rays
methodology
Oxidation

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

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title = "Improving high-temperature oxidation behaviour of Sn-Zn-Ag-Al-Ga solders",
abstract = "Purpose - The purpose of this paper is to study the influence of silver on the high-temperature oxidation behaviour of the Sn-8.5Zn-ITx/ITAg-0.01Al-0.1Ga (ITx/IT=0, 0.1, 0.3 and 0.5) solder alloys. Design/methodology/approach - The weight gains of the studied solders are measured using thermal gravimetric analyzers (TGA) at temperatures of 250, 300, 350 and 400C. The weight gains measured are used to compare the oxidation behaviour of the studied solders. The surfaces of the solders are also analyzed with Auger emission spectroscopy (AES) depth profiling and thin-film X-ray diffractometry (thin-film XRD) to identify the elements present on the surface of the studied solders. Findings - The TGA results show that the weight gains decrease with increasing silver content in the studied solders. It meant that increasing silver content could help improve the high-temperature oxidation behaviour of the studied solder. AES and thin-film XRD confirm that the formed oxide layers on the surface of the studied solder are Zn-based oxide layers. Originality/value - The findings of this paper will help provide an understanding of the effects of silver on Sn-8.5Zn-ITx/ITAg-0.01Al-0.1Ga solder.",
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Improving high-temperature oxidation behaviour of Sn-Zn-Ag-Al-Ga solders. / Yeh, T. K.; Lin, Kwang-Lung; Salam, B.

In: Soldering and Surface Mount Technology, Vol. 21, No. 4, 18.09.2009, p. 19-23.

Research output: Contribution to journalArticle

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AU - Lin, Kwang-Lung

AU - Salam, B.

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