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Inductive 3-coil wireless power transfer improved by T-type impedance matching for implanted biomedical IC

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper applies the printed spiral coil (PSC) using T-type impedance matching in wireless power transfer (WPT) technology for analysis of biomedical implant devices. To reduce the loading effect in the implant devices, three-coil WPT systems are preferred rather than two-coil WPT systems. Two layers comprising of printed spiral resonator coils and load loops on each side of FR4 is designed and fabricated on the side of implantable devices. PSC for biomedical implant devices can be optimized by adjusting geometric parameters. The implanting coil occupies an area of 5×5 mm2 fabricated on a FR4 board. The geometric parameters are investigated to find out PSC optimal values of the impedance matching for the load coil. The power transfer efficiency of the simulated and measured results are compared with for each case. After experiments, compared with other same type of WPT devices, the maximum power is transmitted to the load side to achieve the best efficiency. Finally, at distance of 5 mm, the measured three-coil architecture achieved more than maximum transmission efficiency increases of 83% compared to the equivalent two-coil system.

Original languageEnglish
Title of host publication2015 IEEE Wireless Power Transfer Conference, WPTC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781467374477
DOIs
Publication statusPublished - 2015 Jun 29
Event2015 IEEE Wireless Power Transfer Conference, WPTC 2015 - Boulder, United States
Duration: 2015 May 132015 May 15

Publication series

Name2015 IEEE Wireless Power Transfer Conference, WPTC 2015

Other

Other2015 IEEE Wireless Power Transfer Conference, WPTC 2015
Country/TerritoryUnited States
CityBoulder
Period15-05-1315-05-15

All Science Journal Classification (ASJC) codes

  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering

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