Influence of intermetallic compounds on the adhesive strength of solder joints

Hwa-Teng Lee, Ming Hung Chen

Research output: Contribution to journalArticle

124 Citations (Scopus)

Abstract

This study investigates the influence of intermetallic compound (IMC) growth on the adhesive strength of solder joints. 100Sn and 60Sn40Pb solders were used to solder electrolytic copper wires end to end. Soldered samples were then subjected to high temperature storage testing. The resulting interfacial IMCs in both solders were composed of Cu6Sn5 and Cu3Sn. IMC in the 100Sn solder joint grew faster than in the 60Sn40Pb. The growth behavior of Cu6Sn5 and Cu3Sn were subject to lead concentration. Results of tensile testing revealed an adhesive strength for 60Sn40Pb of 77.3 MPa, higher than the 50.0 MPa for 100Sn. 60Sn40Pb was found more sensitive to high temperature storage than 100Sn.

Original languageEnglish
Pages (from-to)24-34
Number of pages11
JournalMaterials Science and Engineering A
Volume333
Issue number1-2
DOIs
Publication statusPublished - 2002 Aug 1

Fingerprint

solders
Soldering alloys
adhesives
Intermetallics
intermetallics
Adhesives
Tensile testing
Copper
wire
Wire
copper
Temperature
Testing

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

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Influence of intermetallic compounds on the adhesive strength of solder joints. / Lee, Hwa-Teng; Chen, Ming Hung.

In: Materials Science and Engineering A, Vol. 333, No. 1-2, 01.08.2002, p. 24-34.

Research output: Contribution to journalArticle

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