Influence of oxygen on diffusion in the Cu/Mo/Au system

S. Raud, J. S. Chen, M. A. Nicolet

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)


The annealing behaviour of the Cu/Mo/Au metallization system is investigated. Backscattering spectrometry reveals a rapid diffusion of Cu and Au across the Mo film and the formation of AuCu after annealing at 600°C for 30 min in vacuum, but only when no impurity is detected in the as-deposited polycrystalline Mo layer. The Au-Cu interaction is impeded when 5.5 at% of oxygen is introduced in the as-deposited Mo layer. The thin film microstructures are analyzed using X-ray diffraction and transmission electron microscopy. The thermal stability difference between the samples with a pure Mo layer and a contaminated Mo layer is discussed in terms of fast diffusion process inhibited by a grain boundary decoration with oxygen atoms.

Original languageEnglish
Pages (from-to)151-154
Number of pages4
JournalApplied Physics A Solids and Surfaces
Issue number2
Publication statusPublished - 1991 Feb 1

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Engineering(all)
  • Physics and Astronomy (miscellaneous)


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