Influence of Ta/Si atomic ratio on the interdiffusion between Ta-Si-N and Cu at elevated temperature

L. W. Lai, J. S. Chen, Wu Shiung Hsu

Research output: Contribution to journalArticlepeer-review

16 Citations (Scopus)
Original languageEnglish
Pages (from-to)5396-5398
Number of pages3
JournalJournal of Applied Physics
Issue number8
Publication statusPublished - 2003 Oct 15

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy(all)

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