Injection Molding Process Control of Servo-Hydraulic System

Chun Ying Lin, Fang Cheng Shen, Kuo Tsai Wu, Sheng Jye Hwang, Huei Huang Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The present study constructs a servo-hydraulic system to simulate the filling and packing processes of an injection molding machine. Experiments are performed to evaluate the velocity and position control of the system in the filling stage and the pressure control in the packing stage. The results demonstrate that the proposed system meets the required performance standards when operated with a sampling frequency of 1000 Hz.

Original languageEnglish
Title of host publication2019 IEEE Eurasia Conference on IOT, Communication and Engineering, ECICE 2019
EditorsTeen-Hang Meen
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages242-245
Number of pages4
ISBN (Electronic)9781728125015
DOIs
Publication statusPublished - 2019 Oct
Event2019 IEEE Eurasia Conference on IOT, Communication and Engineering, ECICE 2019 - Yunlin, Taiwan
Duration: 2019 Oct 32019 Oct 6

Publication series

Name2019 IEEE Eurasia Conference on IOT, Communication and Engineering, ECICE 2019

Conference

Conference2019 IEEE Eurasia Conference on IOT, Communication and Engineering, ECICE 2019
CountryTaiwan
CityYunlin
Period19-10-0319-10-06

All Science Journal Classification (ASJC) codes

  • Artificial Intelligence
  • Computer Science Applications
  • Information Systems and Management
  • Energy Engineering and Power Technology
  • Safety, Risk, Reliability and Quality
  • Renewable Energy, Sustainability and the Environment
  • Computer Networks and Communications

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  • Cite this

    Lin, C. Y., Shen, F. C., Wu, K. T., Hwang, S. J., & Lee, H. H. (2019). Injection Molding Process Control of Servo-Hydraulic System. In T-H. Meen (Ed.), 2019 IEEE Eurasia Conference on IOT, Communication and Engineering, ECICE 2019 (pp. 242-245). [8942784] (2019 IEEE Eurasia Conference on IOT, Communication and Engineering, ECICE 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECICE47484.2019.8942784