Innovation and annealed effect of Sn-Al and Sn-Cu compositethin films on the electromagnetic interference shielding for the green materials

Fei Shuo Hung, Fei-Yi Hung, Che Ming Chiang, Truan-Sheng Lui

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Sn, Al and Cu not only possess electromagnetic interference shield efficiency, but also have the acceptable costs. In this study, sputtered Sn-Al thin films and Sn-Cu thin film were used to investigate the effect of the crystallization mechanism and film thickness on the electromagnetic interference (EMI) characteristics. In addition, the annealed microstructure, electrical conductivity and EMI of the Sn-xAl films and the Sn-xCu films were compared. The results show that Sn-Al film increased the electromagnetic interference (EMI) shielding after annealed. Sn-Cu films with higher Cu atomic concentration, the low frequency EMI shielding could not be improved. After annealing, the Sn-Cu thin film with lower Cu content possessed excellent EMI shielding at lower frequencies, but had an inverse tendency at higher frequencies.

Original languageEnglish
Title of host publicationRenewable and Sustainable Energy
Pages547-554
Number of pages8
DOIs
Publication statusPublished - 2012 Jan 1
Event2011 International Conference on Energy, Environment and Sustainable Development, ICEESD 2011 - Shanghai, China
Duration: 2011 Oct 212011 Oct 23

Publication series

NameAdvanced Materials Research
Volume347-353
ISSN (Print)1022-6680

Other

Other2011 International Conference on Energy, Environment and Sustainable Development, ICEESD 2011
CountryChina
CityShanghai
Period11-10-2111-10-23

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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