Innovative chemical mechanical polish design and experiments

Nan Chyuan Tsai, Sheng Ming Huang, Chih Che Lin

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

An innovative design for intelligent chemical mechanical polishing (CMP) control system is proposed and verified by experiments. Online measurement and real-time feedback are integrated to eliminate the shortcomings of traditional approaches, e.g., the batch-to-batch discrepancy of required polishing time, over consumption of chemical slurry, and non-uniformity across the wafer. The major advantage of the proposed method is that the finish of local surface roughness can be consistent, no matter where the inner-ring region or outer-ring region is concerned. Secondly, it is able to eliminate the edge effect: the interfacial-induced stress near the wafer edge is generally much higher than that near the wafer center. At last, by using the proposed intelligent chemical mechanical polishing strategy, the quality of the finished goods certainly upgraded.

Original languageEnglish
Pages (from-to)853-864
Number of pages12
JournalInternational Journal of Advanced Manufacturing Technology
Volume72
Issue number5-8
DOIs
Publication statusPublished - 2014 May

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Software
  • Mechanical Engineering
  • Computer Science Applications
  • Industrial and Manufacturing Engineering

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