Innovative wire bonding method using a chemically reacted thin layer for chips with copper interconnects

Yeau-Ren Jeng, Sang Mao Chiu

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

This paper presents a novel method in which an oxide film is used to facilitate the thermosonic wire bonding of gold wire onto copper pads. A cuprous oxide film is generated by controlling the pH values of the chemical solution. Compared to cupric oxide films, the cuprous oxide film is denser and more brittle and therefore facilitates the bonding process without the need for the elaborate procedures and equipment required by more conventional wire bonding methods.

Original languageEnglish
Pages (from-to)279-283
Number of pages5
JournalJournal of Electronic Materials
Volume35
Issue number2
DOIs
Publication statusPublished - 2006 Feb 1

Fingerprint

Oxide films
oxide films
Copper
chips
wire
Wire
copper
Gold
gold
cuprous oxide

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

Cite this

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Innovative wire bonding method using a chemically reacted thin layer for chips with copper interconnects. / Jeng, Yeau-Ren; Chiu, Sang Mao.

In: Journal of Electronic Materials, Vol. 35, No. 2, 01.02.2006, p. 279-283.

Research output: Contribution to journalArticle

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