Innovative wire bonding method using a chemically reacted thin layer for chips with copper interconnects

Yeau Ren Jeng; Sang Mao Chiu

doi:10.1007/BF02692447

Innovative wire bonding method using a chemically reacted thin layer for chips with copper interconnects

Yeau Ren Jeng, Sang Mao Chiu

Department of Biomedical Engineering

Research output: Contribution to journal › Article › peer-review

2 Citations (Scopus)

Abstract

This paper presents a novel method in which an oxide film is used to facilitate the thermosonic wire bonding of gold wire onto copper pads. A cuprous oxide film is generated by controlling the pH values of the chemical solution. Compared to cupric oxide films, the cuprous oxide film is denser and more brittle and therefore facilitates the bonding process without the need for the elaborate procedures and equipment required by more conventional wire bonding methods.

Original language	English
Pages (from-to)	279-283
Number of pages	5
Journal	Journal of Electronic Materials
Volume	35
Issue number	2
DOIs	https://doi.org/10.1007/BF02692447
Publication status	Published - 2006 Feb

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

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10.1007/BF02692447

Cite this

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abstract = "This paper presents a novel method in which an oxide film is used to facilitate the thermosonic wire bonding of gold wire onto copper pads. A cuprous oxide film is generated by controlling the pH values of the chemical solution. Compared to cupric oxide films, the cuprous oxide film is denser and more brittle and therefore facilitates the bonding process without the need for the elaborate procedures and equipment required by more conventional wire bonding methods.",

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N2 - This paper presents a novel method in which an oxide film is used to facilitate the thermosonic wire bonding of gold wire onto copper pads. A cuprous oxide film is generated by controlling the pH values of the chemical solution. Compared to cupric oxide films, the cuprous oxide film is denser and more brittle and therefore facilitates the bonding process without the need for the elaborate procedures and equipment required by more conventional wire bonding methods.

AB - This paper presents a novel method in which an oxide film is used to facilitate the thermosonic wire bonding of gold wire onto copper pads. A cuprous oxide film is generated by controlling the pH values of the chemical solution. Compared to cupric oxide films, the cuprous oxide film is denser and more brittle and therefore facilitates the bonding process without the need for the elaborate procedures and equipment required by more conventional wire bonding methods.

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Innovative wire bonding method using a chemically reacted thin layer for chips with copper interconnects

Abstract

All Science Journal Classification (ASJC) codes

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