Integrated Packaging Design of Low-Cost Bondwire Interconnection for 60-GHz CMOS Vital-Signs Radar Sensor Chip with Millimeter-Wave Planar Antenna

Cheng Hsueh Chan, Chien Chang Chou, Huey-Ru Chuang

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

This paper presents a compact integration design of a low-cost bondwire-interconnection scheme between a 60-GHz CMOS vital-signs Doppler radar sensor chip and a millimeter-wave patch-array planar antenna (17-dBi gain). The interconnection has the form of an inductance-capacitance-inductance structure configured as a T-matching network. It consists of a short microstrip line as a small capacitance and parallel bondwires as inductance. Open-ended stubs are additionally applied in the design to improve the ground connection at 60 GHz. To enhance the robustness of the impedance-matching bandwidth to withstand possible bonding length variations, additional series and shunt transmission lines are also deployed. The proposed low-cost integrated circuit-to-board interconnection design requires no additional processing (e.g., cavity etching of the carrier board). In the experimental measurement, compared with the radar sensor connected with a 7-dB-loss V-band cable to the planar antenna in a previous report, the implemented compact bondwire-interconnected CMOS radar antenna module can enhance the detection range from 75 to at least 105 cm [and potentially up to 120-150 cm if the radar chip output power (0 dBm) is the same as 3 dBm]. This shows the potential facilitation for the incorporation of the 60-GHz radar sensor chip into portable devices for wireless remote physiological monitoring healthcare applications.

Original languageEnglish
Article number8248650
Pages (from-to)177-185
Number of pages9
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume8
Issue number2
DOIs
Publication statusPublished - 2018 Feb 1

Fingerprint

Millimeter waves
Inductance
Packaging
Radar
Antennas
Sensors
Capacitance
Radar antennas
Costs
Doppler radar
Microstrip lines
Printed circuit boards
Integrated circuits
Etching
Electric lines
Cables
Bandwidth
Monitoring
Processing

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Cite this

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abstract = "This paper presents a compact integration design of a low-cost bondwire-interconnection scheme between a 60-GHz CMOS vital-signs Doppler radar sensor chip and a millimeter-wave patch-array planar antenna (17-dBi gain). The interconnection has the form of an inductance-capacitance-inductance structure configured as a T-matching network. It consists of a short microstrip line as a small capacitance and parallel bondwires as inductance. Open-ended stubs are additionally applied in the design to improve the ground connection at 60 GHz. To enhance the robustness of the impedance-matching bandwidth to withstand possible bonding length variations, additional series and shunt transmission lines are also deployed. The proposed low-cost integrated circuit-to-board interconnection design requires no additional processing (e.g., cavity etching of the carrier board). In the experimental measurement, compared with the radar sensor connected with a 7-dB-loss V-band cable to the planar antenna in a previous report, the implemented compact bondwire-interconnected CMOS radar antenna module can enhance the detection range from 75 to at least 105 cm [and potentially up to 120-150 cm if the radar chip output power (0 dBm) is the same as 3 dBm]. This shows the potential facilitation for the incorporation of the 60-GHz radar sensor chip into portable devices for wireless remote physiological monitoring healthcare applications.",
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