TY - JOUR
T1 - Integrated Packaging Design of Low-Cost Bondwire Interconnection for 60-GHz CMOS Vital-Signs Radar Sensor Chip with Millimeter-Wave Planar Antenna
AU - Chan, Cheng Hsueh
AU - Chou, Chien Chang
AU - Chuang, Huey Ru
N1 - Funding Information:
Manuscript received June 28, 2017; revised September 13, 2017 and November 9, 2017; accepted December 7, 2017. Date of publication January 5, 2018; date of current version February 1, 2018. This work was supported by the Ministry of Science and Technology of Taiwan under Grant MOST 105-2221-E-006-244. Recommended for publication by Associate Editor M. S. Tong upon evaluation of reviewers’ comments. (Corresponding author: Huey-Ru Chuang.) The authors are with the Department of Electrical Engineering, Institute of Computer and Communication Engineering, National Cheng Kung University, Tainan 70101, Taiwan (e-mail: [email protected]).
Publisher Copyright:
© 2017 IEEE.
PY - 2018/2
Y1 - 2018/2
N2 - This paper presents a compact integration design of a low-cost bondwire-interconnection scheme between a 60-GHz CMOS vital-signs Doppler radar sensor chip and a millimeter-wave patch-array planar antenna (17-dBi gain). The interconnection has the form of an inductance-capacitance-inductance structure configured as a T-matching network. It consists of a short microstrip line as a small capacitance and parallel bondwires as inductance. Open-ended stubs are additionally applied in the design to improve the ground connection at 60 GHz. To enhance the robustness of the impedance-matching bandwidth to withstand possible bonding length variations, additional series and shunt transmission lines are also deployed. The proposed low-cost integrated circuit-to-board interconnection design requires no additional processing (e.g., cavity etching of the carrier board). In the experimental measurement, compared with the radar sensor connected with a 7-dB-loss V-band cable to the planar antenna in a previous report, the implemented compact bondwire-interconnected CMOS radar antenna module can enhance the detection range from 75 to at least 105 cm [and potentially up to 120-150 cm if the radar chip output power (0 dBm) is the same as 3 dBm]. This shows the potential facilitation for the incorporation of the 60-GHz radar sensor chip into portable devices for wireless remote physiological monitoring healthcare applications.
AB - This paper presents a compact integration design of a low-cost bondwire-interconnection scheme between a 60-GHz CMOS vital-signs Doppler radar sensor chip and a millimeter-wave patch-array planar antenna (17-dBi gain). The interconnection has the form of an inductance-capacitance-inductance structure configured as a T-matching network. It consists of a short microstrip line as a small capacitance and parallel bondwires as inductance. Open-ended stubs are additionally applied in the design to improve the ground connection at 60 GHz. To enhance the robustness of the impedance-matching bandwidth to withstand possible bonding length variations, additional series and shunt transmission lines are also deployed. The proposed low-cost integrated circuit-to-board interconnection design requires no additional processing (e.g., cavity etching of the carrier board). In the experimental measurement, compared with the radar sensor connected with a 7-dB-loss V-band cable to the planar antenna in a previous report, the implemented compact bondwire-interconnected CMOS radar antenna module can enhance the detection range from 75 to at least 105 cm [and potentially up to 120-150 cm if the radar chip output power (0 dBm) is the same as 3 dBm]. This shows the potential facilitation for the incorporation of the 60-GHz radar sensor chip into portable devices for wireless remote physiological monitoring healthcare applications.
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U2 - 10.1109/TCPMT.2017.2782342
DO - 10.1109/TCPMT.2017.2782342
M3 - Article
AN - SCOPUS:85040553945
SN - 2156-3950
VL - 8
SP - 177
EP - 185
JO - IEEE Transactions on Components, Packaging and Manufacturing Technology
JF - IEEE Transactions on Components, Packaging and Manufacturing Technology
IS - 2
M1 - 8248650
ER -