Intelligent data acquisition system for MEMS vibration monitoring applications

Tsung Hsun Wu, Chung Yang Sue, Pei Yin Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The vibration generated by spindle defects, aging and abnormal operation is one of the main reasons causing the lack of precision to machine tools. To solve this problem, manufacturers began to adopt the industrial vibration sensor and data acquisition systems for preventive vibration monitoring, which expected to find abnormal vibration problems early before affecting the quality of processing in order to improve overall processing yield. However, the cost for the available sensors with data acquisition systems is quite expensive and some specifications cannot meet the requirements. Therefore, it is hard to implement or embed into machine tools due to the lower cost requirements and high-performance expectations in industrial applications. In order to develop a data acquisition system that satisfies the needs of machine tool manufacturers, the STMicroelectronics Coretex-M4 chip STM32F429 is adopted as the control core in this study to construct a "low-cost, high-efficiency, intelligent data acquisition system." Moreover, a vibration sensor is combined with the proposed data acquisition system to detect the vibration signal of the machine tool. The measured time-domain vibration data is transmitted to a local computer for fast Fourier transform (FFT) by using the virtual com port. Then, the timedomain and the results of the frequency-domain analysis of the vibration signals are displayed on the designed user interface (UI) at the same time for the user monitoring the current processing status of the machine tool clearly. From the experimental results, the proposed intelligent data acquisition system has both low-cost and high-efficiency features, which provides a high-value total solution for the manufacturers.

Original languageEnglish
Title of host publication13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018
PublisherIEEE Computer Society
Pages252-255
Number of pages4
ISBN (Electronic)9781538656150
DOIs
Publication statusPublished - 2019 Jan 24
Event13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018 - Taipei, Taiwan
Duration: 2018 Oct 242018 Oct 26

Publication series

NameProceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
Volume2018-October
ISSN (Print)2150-5934
ISSN (Electronic)2150-5942

Conference

Conference13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018
CountryTaiwan
CityTaipei
Period18-10-2418-10-26

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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