Intelligent sampling decision scheme based on the AVM system

Fan-Tien Cheng, Chun Fang Chen, Yao Sheng Hsieh, Hsuan Heng Huang, Chu Chieh Wu

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

Wafer inspection plays a significant role in monitoring the quality of wafers production for continuous improvement. However, it requires measuring tools and additional cycle time to do real metrology, which is costly and time-consuming. Therefore, reducing sampling rate to as low as possible is a high priority to reduce production cost. Several sampling methods in the literature were proposed to achieve this goal. They utilised real sampling inspections as the representatives for the other related wafers to monitor the whole production process. Under the condition of stable manufacturing process, virtual metrology (VM) may be applied to monitor the quality of wafers, while real metrology is unavailable. Therefore, the sampling rate may further be reduced with a sampling decision scheme being designed according to reliable VM. Nevertheless, once a new production variation occurs between planned samplings and no real metrology is available during this period for updating the VM models, un-reliable VM predictions may be produced. The authors have developed the automatic virtual metrology (AVM) system for various VM applications. Therefore, this paper focuses on applying various indices of the AVM system to develop an intelligent sampling decision scheme for reducing sampling rate, while VM accuracy is still sustained.

Original languageEnglish
Pages (from-to)2073-2088
Number of pages16
JournalInternational Journal of Production Research
Volume53
Issue number7
DOIs
Publication statusPublished - 2015 Apr 3

Fingerprint

Sampling
Inspection
Monitoring
Costs

All Science Journal Classification (ASJC) codes

  • Strategy and Management
  • Management Science and Operations Research
  • Industrial and Manufacturing Engineering

Cite this

Cheng, Fan-Tien ; Chen, Chun Fang ; Hsieh, Yao Sheng ; Huang, Hsuan Heng ; Wu, Chu Chieh. / Intelligent sampling decision scheme based on the AVM system. In: International Journal of Production Research. 2015 ; Vol. 53, No. 7. pp. 2073-2088.
@article{f7a3563f923445a78e36f4db37921534,
title = "Intelligent sampling decision scheme based on the AVM system",
abstract = "Wafer inspection plays a significant role in monitoring the quality of wafers production for continuous improvement. However, it requires measuring tools and additional cycle time to do real metrology, which is costly and time-consuming. Therefore, reducing sampling rate to as low as possible is a high priority to reduce production cost. Several sampling methods in the literature were proposed to achieve this goal. They utilised real sampling inspections as the representatives for the other related wafers to monitor the whole production process. Under the condition of stable manufacturing process, virtual metrology (VM) may be applied to monitor the quality of wafers, while real metrology is unavailable. Therefore, the sampling rate may further be reduced with a sampling decision scheme being designed according to reliable VM. Nevertheless, once a new production variation occurs between planned samplings and no real metrology is available during this period for updating the VM models, un-reliable VM predictions may be produced. The authors have developed the automatic virtual metrology (AVM) system for various VM applications. Therefore, this paper focuses on applying various indices of the AVM system to develop an intelligent sampling decision scheme for reducing sampling rate, while VM accuracy is still sustained.",
author = "Fan-Tien Cheng and Chen, {Chun Fang} and Hsieh, {Yao Sheng} and Huang, {Hsuan Heng} and Wu, {Chu Chieh}",
year = "2015",
month = "4",
day = "3",
doi = "10.1080/00207543.2014.955924",
language = "English",
volume = "53",
pages = "2073--2088",
journal = "International Journal of Production Research",
issn = "0020-7543",
publisher = "Taylor and Francis Ltd.",
number = "7",

}

Intelligent sampling decision scheme based on the AVM system. / Cheng, Fan-Tien; Chen, Chun Fang; Hsieh, Yao Sheng; Huang, Hsuan Heng; Wu, Chu Chieh.

In: International Journal of Production Research, Vol. 53, No. 7, 03.04.2015, p. 2073-2088.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Intelligent sampling decision scheme based on the AVM system

AU - Cheng, Fan-Tien

AU - Chen, Chun Fang

AU - Hsieh, Yao Sheng

AU - Huang, Hsuan Heng

AU - Wu, Chu Chieh

PY - 2015/4/3

Y1 - 2015/4/3

N2 - Wafer inspection plays a significant role in monitoring the quality of wafers production for continuous improvement. However, it requires measuring tools and additional cycle time to do real metrology, which is costly and time-consuming. Therefore, reducing sampling rate to as low as possible is a high priority to reduce production cost. Several sampling methods in the literature were proposed to achieve this goal. They utilised real sampling inspections as the representatives for the other related wafers to monitor the whole production process. Under the condition of stable manufacturing process, virtual metrology (VM) may be applied to monitor the quality of wafers, while real metrology is unavailable. Therefore, the sampling rate may further be reduced with a sampling decision scheme being designed according to reliable VM. Nevertheless, once a new production variation occurs between planned samplings and no real metrology is available during this period for updating the VM models, un-reliable VM predictions may be produced. The authors have developed the automatic virtual metrology (AVM) system for various VM applications. Therefore, this paper focuses on applying various indices of the AVM system to develop an intelligent sampling decision scheme for reducing sampling rate, while VM accuracy is still sustained.

AB - Wafer inspection plays a significant role in monitoring the quality of wafers production for continuous improvement. However, it requires measuring tools and additional cycle time to do real metrology, which is costly and time-consuming. Therefore, reducing sampling rate to as low as possible is a high priority to reduce production cost. Several sampling methods in the literature were proposed to achieve this goal. They utilised real sampling inspections as the representatives for the other related wafers to monitor the whole production process. Under the condition of stable manufacturing process, virtual metrology (VM) may be applied to monitor the quality of wafers, while real metrology is unavailable. Therefore, the sampling rate may further be reduced with a sampling decision scheme being designed according to reliable VM. Nevertheless, once a new production variation occurs between planned samplings and no real metrology is available during this period for updating the VM models, un-reliable VM predictions may be produced. The authors have developed the automatic virtual metrology (AVM) system for various VM applications. Therefore, this paper focuses on applying various indices of the AVM system to develop an intelligent sampling decision scheme for reducing sampling rate, while VM accuracy is still sustained.

UR - http://www.scopus.com/inward/record.url?scp=84922747284&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84922747284&partnerID=8YFLogxK

U2 - 10.1080/00207543.2014.955924

DO - 10.1080/00207543.2014.955924

M3 - Article

VL - 53

SP - 2073

EP - 2088

JO - International Journal of Production Research

JF - International Journal of Production Research

SN - 0020-7543

IS - 7

ER -