Interconnect reliability modeling for lead-free fan-out chip scale package

Yu Ren Chen, G. S. Shen, Hung Chun Yang, Tz-Cheng Chiu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

The fan-out-type chip scale package (fan-out CSP) is an embedded chip packaging technology that eliminates the need for wirebond and flip-chip bumps. In this study, the board-level reliability of fanout CSP is studied by using three-dimensional finite element analysis. A design of simulations study is applied to investigate the influences of package geometry on the board-level interconnect reliability of fan-out CSP. Results of the analysis ndicate that better board-level reliability for the fan-out CSP can be achieved by using a thicker di with thinner molding compound. In addition, the response surface model obtained from the design of simulations study can be served a the basis for further fan-out CSP design optimization.

Original languageEnglish
Title of host publication2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
Pages115-119
Number of pages5
DOIs
Publication statusPublished - 2008 Dec 1
Event2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008 - Taipei, Taiwan
Duration: 2008 Oct 222008 Oct 24

Publication series

Name2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008

Other

Other2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
CountryTaiwan
CityTaipei
Period08-10-2208-10-24

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Mechanical Engineering

Fingerprint Dive into the research topics of 'Interconnect reliability modeling for lead-free fan-out chip scale package'. Together they form a unique fingerprint.

  • Cite this

    Chen, Y. R., Shen, G. S., Yang, H. C., & Chiu, T-C. (2008). Interconnect reliability modeling for lead-free fan-out chip scale package. In 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008 (pp. 115-119). [4784243] (2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008). https://doi.org/10.1109/EMAP.2008.4784243