Interdiffusion behavior at the interfaces between deposits of Au nanoparticles and electronic substrates

Tzu Hsuan Kao, Jenn Ming Song, In-Gann Chen, Teng Yuan Dong, Weng Sing Hwang

Research output: Contribution to journalArticle

8 Citations (Scopus)

Abstract

This study investigated the interfacial behavior between thiol-stabilized Au nanoparticle (NP) deposits and the commonly used electronic substrates, Cu, Ni and Ag. Instead of sintering or agglomerating, curing at 300°C resulted in either entire or partial melting of the deposited suspension because of the substantially low melting point of the Au NPs due to the nanosize effect; the melting point was measured to be 230-270°C. Thus a liquid-solid reaction might occur between the NP Au deposits and substrates during the thermal process. The elemental depth profiles examined by x-ray photoelectron spectroscopy (XPS) demonstrated that stoichiometric intermetallic phases, likely Cu3Au and NiAu3, existed respectively at the Au/Cu and Au/Ni interfaces, while a miscible solid solution of nonstoichiometric layer was found to have emerged at the Au/Ag interface. Also, the chemical shifts of binding energies inspected at the reaction layers reflected the alloying behavior at those interfaces.

Original languageEnglish
Article number435708
JournalNanotechnology
Volume18
Issue number43
DOIs
Publication statusPublished - 2007 Oct 31

Fingerprint

Interdiffusion (solids)
Melting point
Deposits
Nanoparticles
Chemical shift
Substrates
Photoelectron spectroscopy
Binding energy
Alloying
Sulfhydryl Compounds
Intermetallics
Curing
Solid solutions
Suspensions
Melting
Sintering
X rays
Liquids
Hot Temperature

All Science Journal Classification (ASJC) codes

  • Bioengineering
  • Chemistry(all)
  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

Kao, Tzu Hsuan ; Song, Jenn Ming ; Chen, In-Gann ; Dong, Teng Yuan ; Hwang, Weng Sing. / Interdiffusion behavior at the interfaces between deposits of Au nanoparticles and electronic substrates. In: Nanotechnology. 2007 ; Vol. 18, No. 43.
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Interdiffusion behavior at the interfaces between deposits of Au nanoparticles and electronic substrates. / Kao, Tzu Hsuan; Song, Jenn Ming; Chen, In-Gann; Dong, Teng Yuan; Hwang, Weng Sing.

In: Nanotechnology, Vol. 18, No. 43, 435708, 31.10.2007.

Research output: Contribution to journalArticle

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