Interfacial bonding behavior with introduction of Sn-Zn-Bi paste to Sn-Ag-Cu ball grid array package during multiple reflows

Po Cheng Shih, Kwang Lung Lin

Research output: Contribution to journalArticlepeer-review

16 Citations (Scopus)

Abstract

Sn-8Zn-3Bi solder paste and Sn-3.2Ag-0.5Cu solder balls were reflowed simultaneously on Cu/Ni/Au metallized ball grid array (BGA) substrates to investigate the interfacial bonding behaviors for multiple reflow cycles at two different soldering temperature of 210 and 240 °C. The different intermetallic compounds that formed at the interface after one reflow cycle were respectively the island-shaped Ag-Au-Cu-Zn (near the solder) compounds and the Ni-Sn-Cu-Zn (near the metallized pad) compounds in 210 or 240 °C soldering systems. Layered Ag-Au-Cu-Zn, Ag5Zn8, and Ag-Zn-Sn compounds were also observed within the solder near the interface after single reflow cycle. After ten reflow cycles, the Ag-Au-Cu-Zn compounds significantly decomposed, while the Ag3Sn and Ni-Sn-Cu-Zn compounds coarsened obviously.

Original languageEnglish
Pages (from-to)219-229
Number of pages11
JournalJournal of Materials Research
Volume20
Issue number1
DOIs
Publication statusPublished - 2005 Jan

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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