Sn-8Zn-3Bi solder paste and Sn-3.2Ag-0.5Cu solder balls were reflowed simultaneously on Cu/Ni/Au metallized ball grid array (BGA) substrates to investigate the interfacial bonding behaviors for multiple reflow cycles at two different soldering temperature of 210 and 240 °C. The different intermetallic compounds that formed at the interface after one reflow cycle were respectively the island-shaped Ag-Au-Cu-Zn (near the solder) compounds and the Ni-Sn-Cu-Zn (near the metallized pad) compounds in 210 or 240 °C soldering systems. Layered Ag-Au-Cu-Zn, Ag5Zn8, and Ag-Zn-Sn compounds were also observed within the solder near the interface after single reflow cycle. After ten reflow cycles, the Ag-Au-Cu-Zn compounds significantly decomposed, while the Ag3Sn and Ni-Sn-Cu-Zn compounds coarsened obviously.
All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering